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SN74HCT240DWRE4

Texas Instruments

SN74HCT240DWRE4 by Texas Instruments

SN74HCT240DWRE4 by Texas Instruments is a 20-terminal bus driver with 2 functions, featuring a propagation delay of 32ns and operating temperature range of -40 to 85°C. Ideal for industrial applications requiring CMOS technology, it has an inverted output polarity and supports a supply voltage range of 4.5V to 5.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,224 parts In-Stock

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Digiode

USA . 450 parts In-Stock

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450

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Nova Conductors

Japan . 64 parts In-Stock

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64

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Distributors (Availability)

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Andel Nordic

Denmark . 2,670 parts In-Stock

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$2.362

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$2.268

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$2.268

2,670

$2.362

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$2.268

$2.268

AZTECH Wire

Italy . 266 parts In-Stock

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$14.127

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Parana Technologies

USA . 113 parts In-Stock

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$22.947

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$23.598

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113

$22.947

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$23.598

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ChromeModa Solutions

Germany . 3,978 parts In-Stock

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$25.783

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$21.142

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$25.783

$21.142

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IDEA Electronic Components Group

UK . 414 parts In-Stock

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$25.783

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$24.494

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$23.205

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$25.783

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One Stop Electronics

USA . 811 parts In-Stock

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$31.000

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Corohmni

South Africa . 363 parts In-Stock

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$32.332

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$32.332

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Ampacity Inc.

Singapore . 1,183 parts In-Stock

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$51.000

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Continental Prestige Electronics

USA . 6,844 parts In-Stock

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Corphita

USA . 4,326 parts In-Stock

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Microchip USA

USA . 2,697 parts In-Stock

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DigiPath Technology Company

USA . 2,107 parts In-Stock

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$23.246

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Argo Parts USA

USA . 1,357 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,301 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the superior quality of Texas Instruments with the SN74HCT240DWRE4, a top-of-the-line Bus Driver & Transceiver. This versatile component offers customers a reliable solution for their electronic needs, with applications ranging from automotive to industrial settings. With a focus on precision and efficiency, this product ensures optimal performance while providing value and benefits that exceed expectations. Trust in Texas Instruments to deliver cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures fast and efficient communication within the bus system.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes the product compatible with a wide range of systems.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space on the circuit board, ideal for applications where real estate is limited.

Output Characteristics: 3-STATE

3-state output allows for tri-state logic, providing flexibility in controlling the logic levels of the outputs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the product suitable for industrial applications where temperature fluctuations may occur.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74HCT240DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74HCT240DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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