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SN74HC645NSRE4

Texas Instruments

SN74HC645NSRE4 by Texas Instruments

SN74HC645NSRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 26 ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85 °C). Commonly used for bidirectional control applications due to its compact size (12.6mm x 5.3mm) and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,626 parts In-Stock

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Vyrian

USA . 3,115 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 626 parts In-Stock

1+ parts

$7.517

100+ parts

-

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$8.025

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626

$7.517

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$8.025

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DigiPath Technology Company

USA . 281 parts In-Stock

1+ parts

$8.277

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-

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281

$8.277

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ChromeModa Solutions

Germany . 5,796 parts In-Stock

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$8.446

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$6.926

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5,796

$8.446

$6.926

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

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$8.446

100+ parts

$8.024

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$7.601

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1,523

$8.446

$8.024

$7.601

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Andel Nordic

Denmark . 3,932 parts In-Stock

1+ parts

$9.963

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$9.565

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$9.565

3,932

$9.963

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$9.565

$9.565

AZTECH Wire

Italy . 312 parts In-Stock

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$18.105

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312

$18.105

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One Stop Electronics

USA . 477 parts In-Stock

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$65.000

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477

$65.000

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Component Stockers USA

USA . 455 parts In-Stock

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$99.990

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455

$99.990

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Corphita

USA . 594 parts In-Stock

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Microchip USA

USA . 291 parts In-Stock

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Overview

Unlock seamless data transmission and superior performance with the Texas Instruments SN74HC645NSRE4 Bus Driver & Transceivers. Crafted with precision using cutting-edge CMOS technology, this industrial-grade component boasts a dual-terminal design for bidirectional control. With a compact small outline package and 3-STATE output characteristics, this product offers a true value proposition for your electronic applications. Trust in Texas Instruments' legacy of excellence and elevate your projects with the reliability and efficiency of the SN74HC645NSRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 26 ns

Low propagation delay ensures quick signal transmission and efficient data transfer.

Surface Mount: YES

Facilitates easy installation and space-saving design for compact electronic assemblies.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently at a standard voltage level, ensuring compatibility with a wide range of systems.

Power Supplies (V): 2/6

Compatible with various power supply voltages, offering flexibility in operating conditions.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with demanding conditions.

Technical Specifications

Bus Driver & Transceivers SN74HC645NSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

Length:

12.6 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74HC645NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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