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SN74GTLP1395DWG4

Texas Instruments

SN74GTLP1395DWG4 by Texas Instruments

SN74GTLP1395DWG4 by Texas Instruments is a 3.3V bus driver with 2 functions, translating GTLP & LVTTL signals. It features a propagation delay of 6.3ns and operates in industrial temperatures (-40 to 85°C). Ideal for bidirectional applications requiring independent control, it comes in a small outline package measuring 12.8mm x 7.5mm x 2.65mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,934 parts In-Stock

1+ parts

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7,934

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Digiode

USA . 74 parts In-Stock

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74

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Distributors (Availability)

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Andel Nordic

Denmark . 2,864 parts In-Stock

1+ parts

$4.190

100+ parts

-

1k+ parts

$4.022

10k+ parts

$4.022

2,864

$4.190

-

$4.022

$4.022

Parana Technologies

USA . 787 parts In-Stock

1+ parts

$7.497

100+ parts

-

1k+ parts

$7.995

10k+ parts

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787

$7.497

-

$7.995

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DigiPath Technology Company

USA . 1,155 parts In-Stock

1+ parts

$8.256

100+ parts

$7.595

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-

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1,155

$8.256

$7.595

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IDEA Electronic Components Group

UK . 444 parts In-Stock

1+ parts

$8.424

100+ parts

$8.003

1k+ parts

$7.582

10k+ parts

-

444

$8.424

$8.003

$7.582

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ChromeModa Solutions

Germany . 70 parts In-Stock

1+ parts

$8.424

100+ parts

$6.908

1k+ parts

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70

$8.424

$6.908

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AZTECH Wire

Italy . 263 parts In-Stock

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$15.200

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263

$15.200

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One Stop Electronics

USA . 762 parts In-Stock

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$23.000

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762

$23.000

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Corphita

USA . 4,329 parts In-Stock

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4,329

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Microchip USA

USA . 230 parts In-Stock

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Overview

Elevate your electronic designs with the SN74GTLP1395DWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Bus Driver & Transceivers category. This versatile product offers seamless translation between GTLP & LVTTL, making it perfect for a wide range of applications. With a nominal supply voltage of 3.3V, configurable output polarity, and independent control, this small outline package is a powerhouse of performance. Experience the value and benefits of Texas Instruments technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and making installation efficient.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, simplifying the design and reducing costs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is commonly used in many electronic systems, providing compatibility and ease of use.

Propagation Delay (tpd): 6.3 ns

The low propagation delay ensures fast data transmission, making the product suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating environments, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SN74GTLP1395DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

100 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTLP & LVTTL

Width:

7.5 mm

Trade Compliance

SN74GTLP1395DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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