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SN74AUP1G04DCKRG4

Texas Instruments

SN74AUP1G04DCKRG4 by Texas Instruments

SN74AUP1G04DCKRG4 by Texas Instruments is a CMOS logic gate with 19ns propagation delay at 1.2V, suitable for industrial applications. It has a max supply voltage of 3.6V, operates b/w -40 to 85°C, and features a small outline package with dual terminals.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 243,430 parts In-Stock

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Vyrian

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Digiode

USA . 2,929 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 306 parts In-Stock

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$11.614

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Parana Technologies

USA . 1,860 parts In-Stock

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$12.529

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ChromeModa Solutions

Germany . 2,955 parts In-Stock

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$14.078

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$11.544

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IDEA Electronic Components Group

UK . 335 parts In-Stock

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$14.078

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$13.374

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$12.670

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Ampacity Inc.

Singapore . 1,092 parts In-Stock

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$26.000

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One Stop Electronics

USA . 762 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 2,083 parts In-Stock

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Microchip USA

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Aranea Global

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iodParts Technologies Inc.

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Overview

Discover the cutting-edge SN74AUP1G04DCKRG4 logic gate by Texas Instruments, a leading manufacturer known for top-quality electronic components. This versatile product is perfect for a wide range of applications in the logic gates category, offering customers reliable performance and efficiency. With a nominal supply voltage of 1.2V and a maximum operating temperature of 85°C, this small outline, thin profile package is designed to meet industrial standards. Experience the value and benefits of Texas Instruments' innovative technology with the SN74AUP1G04DCKRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 19 ns

With a low propagation delay of 19 ns, this logic gate offers fast processing speed for efficient operation.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on the board, enabling compact and organized circuit designs.

Nominal Supply Voltage / Vsup: 1.2V

The low nominal supply voltage of 1.2V helps in reducing power consumption, making it energy-efficient.

Load Capacitance (CL): 30 pF

The 30 pF load capacitance ensures stable performance and reliable signal transmission within the circuit.

Power Supplies (V): 1.2/3.3

With multiple power supply options of 1.2V and 3.3V, this logic gate provides flexibility for different voltage requirements in various applications.

No. of Terminals: 5

The five terminals offer sufficient connectivity options for integrating the logic gate into the circuit effectively.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style minimize space occupation on the board, ideal for compact electronic devices.

Maximum I (ol): 4 Amp

With a maximum output current of 4A, this logic gate can drive high-power components without any performance issues.

Propagation Delay (tpd): 19 ns

The consistent propagation delay of 19 ns ensures accurate and synchronized signal processing for optimal functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this logic gate to withstand harsh environmental conditions, enhancing its reliability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate can function effectively in extreme cold environments without any performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection options, catering to different circuit board layouts.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1 mm allows for slim and compact circuit board designs, saving space in electronic devices.

Width: 1.25 mm

The narrow width of 1.25 mm enables dense packing of logic gates on the board, facilitating efficient use of available space.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage of 0.8V ensures compatibility with a wide range of power sources, enhancing the versatility of this product.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and reliable connection during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate can withstand high-temperature soldering processes without any damage.

Length: 2 mm

The compact length of 2 mm contributes to a space-efficient design, making it suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature requirements, this logic gate can function reliably in demanding environments.

Technology: CMOS

The CMOS technology used in this logic gate offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, enhancing the durability and stability of the logic gate.

Packing Method: TR

The TR packing method ensures safe and organized storage of logic gates, preventing damage during transportation and handling.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm allows for precise and compact placement of logic gates on the circuit board, optimizing board space utilization.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V offers compatibility with a wide range of power sources, making this logic gate suitable for diverse applications.

Maximum Power Supply Current (ICC): 0.01 mA

With a maximum power supply current of 0.01mA, this logic gate operates efficiently without overloading the power source.

Technical Specifications

Logic Gates SN74AUP1G04DCKRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

19 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUP1G04DCKRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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