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SN74AS646NT

Texas Instruments

SN74AS646NT by Texas Instruments

SN74AS646NT by Texas Instruments is an 8-bit bus driver with a propagation delay of 9ns at 5V. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. Ideal for bidirectional applications requiring independent control, it comes in a rectangular package with through-hole terminals.

Median Price

$7.690

Lifecycle Status

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30

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USA . 17 parts In-Stock

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Component Electronics Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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PC Components Company LLC

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First Choice Components Inc.

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Mentor Electronics Marketing, LLC

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Elcom Components

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Distributors (Availability)

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AZTECH Wire

Italy . 806 parts In-Stock

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Andel Nordic

Denmark . 1,384 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

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Component Stockers USA

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Overview

Unlock seamless data transmission with the SN74AS646NT from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers & transceivers for various applications. This product boasts a powerful performance with a propagation delay of only 9 ns, making it perfect for high-speed data transfers. Its 3-STATE output characteristics and TRUE output polarity ensure reliable communication. Trust Texas Instruments to provide innovative solutions for your connectivity needs. Elevate your projects with the SN74AS646NT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for rugged use in various conditions.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay ensures fast and efficient signal transmission, making this product ideal for applications where timing is critical.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used voltage level of 5V ensures compatibility with a wide range of systems and components.

Maximum I (ol): 48 Amp

The high output current capability allows this product to drive heavy loads, making it suitable for driving bus lines and transceivers in various communication systems.

Output Characteristics: 3-STATE

The 3-state output feature allows the bus driver to have a high-impedance state, enabling multiple drivers to share a bus without causing signal conflicts.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels, making this product a versatile choice for interfacing with TTL-based systems.

Technical Specifications

Bus Driver & Transceivers SN74AS646NT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

DIRECTION CONTROL; SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED OR REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AS

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Length:

31.64 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

211 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

SN74AS646NT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-354-8217, 5962013548217

NIIN

013548217

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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