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SN74ALVC32PWRG4

Texas Instruments

SN74ALVC32PWRG4 by Texas Instruments

SN74ALVC32PWRG4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 1.8V and has a propagation delay of 2.8ns. This CMOS technology device is ideal for industrial applications requiring fast signal processing in compact spaces, with a small outline package style and surface mount capability.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,888 parts In-Stock

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$0.120

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$0.120

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2,888

$0.120

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Chip Stock

USA . 100,700 parts In-Stock

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Vyrian

USA . 8,039 parts In-Stock

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Semi Source

USA . 4,255 parts In-Stock

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Digiode

USA . 2,852 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Mil-Aero Solutions, Inc.

USA . 22 parts In-Stock

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Parana Technologies

USA . 1,967 parts In-Stock

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$13.125

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$13.627

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DigiPath Technology Company

USA . 2,147 parts In-Stock

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$14.452

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$13.296

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ChromeModa Solutions

Germany . 3,127 parts In-Stock

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$14.747

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$12.093

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IDEA Electronic Components Group

UK . 693 parts In-Stock

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$14.747

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$14.010

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$13.272

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693

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AZTECH Wire

Italy . 221 parts In-Stock

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Corohmni

South Africa . 129 parts In-Stock

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$16.836

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One Stop Electronics

USA . 1,405 parts In-Stock

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Ampacity Inc.

Singapore . 937 parts In-Stock

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Corphita

USA . 2,344 parts In-Stock

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Continental Prestige Electronics

USA . 2,087 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unleash the power of innovation with the SN74ALVC32PWRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in every product they create. The SN74ALVC32PWRG4 is a versatile logic gate that offers fast propagation delay, low power consumption, and high performance. Ideal for a wide range of applications, this logic gate is designed to meet the demands of today's technology-driven world. Experience the value and benefits of the SN74ALVC32PWRG4 and take your projects to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making it a reliable choice for the package body.

Propagation Delay At Nominal Supply: 2.8 ns

Low propagation delay means fast processing speed, making this product suitable for high-speed applications.

No. of Functions: 4

Having 4 functions in one package increases efficiency and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Technical Specifications

Logic Gates SN74ALVC32PWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2.8 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74ALVC32PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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