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SN74ALS541NSRG4

Texas Instruments

SN74ALS541NSRG4 by Texas Instruments

SN74ALS541NSRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 14ns at 5V. It features 3-STATE output characteristics and operates within a temperature range of 0 to 70°C. Ideal for applications requiring true output polarity control in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,900 parts In-Stock

1+ parts

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5,900

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Vyrian

USA . 2,679 parts In-Stock

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2,679

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Digiode

USA . 1,165 parts In-Stock

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1,165

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 471 parts In-Stock

1+ parts

$6.287

100+ parts

-

1k+ parts

$6.036

10k+ parts

$6.036

471

$6.287

-

$6.036

$6.036

Parana Technologies

USA . 1,119 parts In-Stock

1+ parts

$13.897

100+ parts

$1,290.580

1k+ parts

$12.508

10k+ parts

-

1,119

$13.897

$1,290.580

$12.508

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DigiPath Technology Company

USA . 707 parts In-Stock

1+ parts

$15.303

100+ parts

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707

$15.303

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ChromeModa Solutions

Germany . 4,910 parts In-Stock

1+ parts

$15.615

100+ parts

$12.804

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4,910

$15.615

$12.804

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IDEA Electronic Components Group

UK . 1,083 parts In-Stock

1+ parts

$15.615

100+ parts

$14.834

1k+ parts

$14.054

10k+ parts

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1,083

$15.615

$14.834

$14.054

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AZTECH Wire

Italy . 236 parts In-Stock

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$17.154

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236

$17.154

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Corohmni

South Africa . 540 parts In-Stock

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$33.006

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540

$33.006

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Ampacity Inc.

Singapore . 1,255 parts In-Stock

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$39.000

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$39.000

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One Stop Electronics

USA . 991 parts In-Stock

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$59.000

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991

$59.000

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Component Stockers USA

USA . 300 parts In-Stock

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$99.990

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300

$99.990

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Argo Parts USA

USA . 5,227 parts In-Stock

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Corphita

USA . 4,525 parts In-Stock

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Continental Prestige Electronics

USA . 2,930 parts In-Stock

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2,930

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Microchip USA

USA . 2,346 parts In-Stock

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2,346

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Enhance your electronic projects with the SN74ALS541NSRG4 by Texas Instruments, a top-quality bus driver & transceiver designed to deliver reliable performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product offers unparalleled value and benefits to customers. Whether you're designing communication systems, computer peripherals, or industrial controls, this 8-bit bus driver boasts a fast propagation delay of 14 ns and a 3-STATE output, making it an ideal choice for your applications. Upgrade your designs with the Texas Instruments SN74ALS541NSRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, suitable for harsh operating environments.

Propagation Delay At Nominal Supply: 14 ns

With a low propagation delay of 14 ns at nominal supply voltage, this product ensures fast and efficient signal transmission.

Surface Mount: YES

The surface mount capability of this product makes it easy to install and saves space on the PCB, ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient placement on the PCB and maximizes space utilization.

No. of Bits: 8

With 8 bits, this product offers a sufficient number of outputs for various applications, providing flexibility and versatility.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance in high-speed data transmission applications.

Power Supplies (V): 5

This product supports power supplies of 5V, ensuring compatibility with a wide range of systems and simplifying the design process.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for interfacing with other components, enhancing system integration capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product saves space on the PCB and allows for efficient layout designs in compact applications.

Technical Specifications

Bus Driver & Transceivers SN74ALS541NSRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ALS541NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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