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SN74AHCT374DGVRE4

Texas Instruments

SN74AHCT374DGVRE4 by Texas Instruments

SN74AHCT374DGVRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns at 5V, suitable for industrial applications. It features a max frequency of 75MHz, operates b/w -40 to 85°C, and has a true output polarity. This CMOS technology device comes in a small outline package with dual terminals and supports positive edge triggering.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,059 parts In-Stock

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Vyrian

USA . 2,037 parts In-Stock

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2,037

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Andel Nordic

Denmark . 3,591 parts In-Stock

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$6.056

100+ parts

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$5.814

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$5.814

3,591

$6.056

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$5.814

$5.814

AZTECH Wire

Italy . 568 parts In-Stock

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$11.508

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568

$11.508

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Parana Technologies

USA . 1,759 parts In-Stock

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$26.227

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$26.822

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$26.822

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DigiPath Technology Company

USA . 1,688 parts In-Stock

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$28.879

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1,688

$28.879

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ChromeModa Solutions

Germany . 1,582 parts In-Stock

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$29.468

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$24.164

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$29.468

$24.164

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IDEA Electronic Components Group

UK . 152 parts In-Stock

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$29.468

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$27.995

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$26.521

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152

$29.468

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$26.521

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One Stop Electronics

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$31.000

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Corphita

USA . 970 parts In-Stock

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Microchip USA

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Overview

Discover the Texas Instruments SN74AHCT374DGVRE4, a top-quality Bus Driver & Transceiver designed to enhance your electronic projects. With a focus on innovation and reliability, Texas Instruments delivers cutting-edge technology that meets the highest industry standards. This versatile component is perfect for a wide range of applications, providing seamless connectivity and optimal performance. Experience the value and benefits of this product, offering fast propagation delay, 3-STATE output characteristics, and a compact design that fits perfectly into any project. Upgrade your circuits with the SN74AHCT374DGVRE4 and unlock endless possibilities for your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the bus driver & transceivers, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during the assembly process.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts, making integration into existing systems straightforward.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, ensuring compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception, ensuring reliable performance in various operating conditions.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation and signal integrity, making this product suitable for demanding industrial applications.

No. of Terminals: 20

Sufficient number of terminals for connecting to multiple components and peripherals, providing flexibility in system design and connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch saves space on the PCB, ideal for applications with size constraints.

Maximum I (ol): 8 Amp

High output current capacity of 8A allows for driving multiple loads or components with ease, making this product versatile in various system configurations.

Propagation Delay (tpd): 11.5 ns

Low propagation delay ensures minimal signal delay and fast response times, crucial for high-performance communication systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range up to 85°C allows for reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, enabling easy integration with other components and preventing signal interference.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures accurate signal detection and synchronization, essential for reliable data transmission in digital systems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments or during temperature fluctuations, making this product suitable for outdoor applications.

Terminal Position: DUAL

Dual terminal position provides versatility in circuit board layout and design, accommodating different mounting orientations for easy installation.

No. of Ports: 2

Two ports for connecting to multiple devices or peripherals, increasing the flexibility and scalability of the system.

Maximum Seated Height: 1.2 mm

Low profile with a maximum seated height of 1.2mm allows for compact integration into space-constrained electronic systems.

Width: 4.4 mm

Compact width of 4.4mm saves space on the PCB, suitable for applications with limited board real estate.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, preventing signal distortion and ensuring reliable communication between components.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage of 4.5V allows for operation in low-power environments or with energy-efficient systems, saving energy and costs.

Length: 5 mm

Compact length of 5mm saves space on the PCB, ideal for miniaturized electronic devices or systems with tight size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments, making this product suitable for rugged industrial applications.

Maximum Frequency At Nominal Supply: 75000000 Hz

High maximum frequency capability of 75MHz allows for fast data processing and high-speed communication, ideal for applications requiring high data bandwidth.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy electrical environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and mechanical stability, ensuring reliable performance and durability in demanding applications.

Packing Method: TR

TR packing method offers convenient packaging for automated assembly and handling, streamlining the production process and reducing assembly time.

Terminal Pitch: 0.4 mm

Narrow terminal pitch of 0.4mm allows for high-density mounting on the PCB, saving space and enabling compact system design.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5V provides extra margin for voltage fluctuations and ensures stable operation in varying power conditions, enhancing reliability and system robustness.

Technical Specifications

Bus Driver & Transceivers SN74AHCT374DGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74AHCT374DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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