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SN74AHC1G08DCKTG4

Texas Instruments

SN74AHC1G08DCKTG4 by Texas Instruments

SN74AHC1G08DCKTG4 by Texas Instruments is a CMOS logic gate with 2 inputs, 14ns propagation delay, and 3.3V nominal voltage. It is used in military-grade applications due to its Schmitt Trigger feature, operates b/w -55 to 125 °C, and has a small outline package style for compact designs.

Median Price

$1.760

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 425 parts In-Stock

1+ parts

$1.760

100+ parts

$0.834

1k+ parts

$0.473

10k+ parts

$0.449

425

$1.760

$0.834

$0.473

$0.449

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.363

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-

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$0.363

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Digiode

USA . 2,630 parts In-Stock

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$0.893

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2,630

$0.893

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Chip Stock

USA . 531,990 parts In-Stock

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531,990

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Vyrian

USA . 5,253 parts In-Stock

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Bristol Electronics

USA . 23 parts In-Stock

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Argo Parts USA

USA . 3,305 parts In-Stock

1+ parts

$0.363

100+ parts

-

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$0.353

3,305

$0.363

-

-

$0.353

Continental Prestige Electronics

USA . 1,343 parts In-Stock

1+ parts

$0.363

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-

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$0.356

1,343

$0.363

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$0.356

Corphita

USA . 2,560 parts In-Stock

1+ parts

$0.846

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2,560

$0.846

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Semicontronic

India . 423 parts In-Stock

1+ parts

$1.360

100+ parts

$1.326

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$1.319

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423

$1.360

$1.326

$1.319

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Ampacity Inc.

Singapore . 29 parts In-Stock

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$1.360

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29

$1.360

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AZTECH Wire

Italy . 546 parts In-Stock

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$5.014

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546

$5.014

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Corohmni

South Africa . 662 parts In-Stock

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$9.937

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$9.937

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Parana Technologies

USA . 150 parts In-Stock

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$28.472

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$47.906

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$28.472

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$47.906

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DigiPath Technology Company

USA . 677 parts In-Stock

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$31.351

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677

$31.351

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ChromeModa Solutions

Germany . 2,743 parts In-Stock

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$31.991

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$26.233

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2,743

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$26.233

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IDEA Electronic Components Group

UK . 691 parts In-Stock

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$31.991

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$30.391

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$28.792

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691

$31.991

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$28.792

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QUARKTWIN TECHNOLOGY LTD

USA . 27,476 parts In-Stock

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Microchip USA

USA . 3,671 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.356

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$0.345

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$0.338

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$0.356

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$0.338

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the SN74AHC1G08DCKTG4 logic gate by Texas Instruments. Known for their high-quality products, Texas Instruments brings you a reliable and efficient solution for your circuit needs. This logic gate is perfect for a variety of applications, offering fast propagation delays and low power consumption. With its compact design and wide operating temperature range, this product provides value and flexibility to customers looking for top-notch performance. Upgrade your projects today with the SN74AHC1G08DCKTG4 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the logic gates, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications where quick response time is crucial.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into circuit boards, saving space and simplifying the assembly process.

No. of Inputs: 2

Having two inputs provides flexibility in logic operations, allowing for more complex functions to be implemented with the logic gates.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with many systems and reducing the need for additional components for voltage regulation.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stability in signal transmission and reception, preventing signal distortion and errors in data processing.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages, allowing for versatility in use and compatibility with various power sources.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and sleek design makes these logic gates suitable for space-constrained applications while maintaining high performance.

Maximum I (ol): 8 Amp

High output current capability allows for driving multiple loads or components without risking damage to the logic gates, enhancing reliability.

Propagation Delay (tpd): 14 ns

Low propagation delay ensures fast response time, critical in applications where timing is crucial for accurate operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments or industrial applications with elevated operating conditions.

Output Characteristics: 3-STATE

The 3-state output feature allows for additional flexibility in signal control, enabling the logic gates to drive multiple outputs and enter a high-impedance state when not in use.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely cold conditions, making it suitable for applications where temperature fluctuations are common or where low-temperature operation is required.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for long-term performance.

Terminal Position: DUAL

Dual terminal position allows for easy and flexible installation on PCBs, providing multiple mounting options that cater to different circuit designs.

Maximum Seated Height: 1.1 mm

Low profile design with a maximum seated height of 1.1 mm enables space-saving integration into compact electronic devices or systems.

Width: 1.25 mm

Narrow width facilitates efficient PCB layout and compact circuit design, especially beneficial in applications with limited board space.

Minimum Supply Voltage (Vsup): 2 V

Capable of operating at low supply voltages, making it suitable for battery-powered devices or applications with power constraints.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the reflow soldering process, ensuring reliable and durable solder joints for secure PCB mounting.

Length: 2 mm

Compact length allows for efficient use of board space and easy integration into densely populated circuits, enhancing overall system design.

Temperature Grade: MILITARY

Mil-spec temperature grade ensures reliability and performance in harsh environmental conditions, making it suitable for military or aerospace applications.

Schmitt Trigger: YES

Incorporation of Schmitt trigger allows for noise immunity and hysteresis, ensuring stable and accurate signal processing even in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits, making it a versatile and efficient choice.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical and electrical connection to the PCB, minimizing the risk of solder joint failures and ensuring long-term reliability.

Packing Method: TR, 7 INCH

Tape and reel packing method facilitates automated assembly processes and protects the components during storage and transportation, ensuring product quality and reliability.

Terminal Pitch: 0.65 mm

Compact terminal pitch of 0.65 mm enables high-density mounting, allowing for more logic gates to be integrated within a limited PCB area, optimizing space efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of operating at a maximum supply voltage of 5.5 V, providing a wide voltage range for compatibility with various systems and power sources.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current ensures energy efficiency and minimizes power consumption, making it suitable for battery-powered devices or applications with power constraints.

Technical Specifications

Logic Gates SN74AHC1G08DCKTG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74AHC1G08DCKTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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