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SN74AHC132DRE4

Texas Instruments

SN74AHC132DRE4 by Texas Instruments

SN74AHC132DRE4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 11 ns at 3.3V, making it suitable for automotive applications requiring fast response times. With a small outline package style and Schmitt trigger technology, this device is ideal for surface mount designs in harsh environments.

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2

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1k+

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Vyrian

USA . 4,077 parts In-Stock

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Digiode

USA . 3,915 parts In-Stock

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3,915

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AZTECH Wire

Italy . 506 parts In-Stock

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$16.206

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506

$16.206

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Parana Technologies

USA . 674 parts In-Stock

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$26.465

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$27.050

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674

$26.465

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DigiPath Technology Company

USA . 914 parts In-Stock

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$29.141

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$26.810

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914

$29.141

$26.810

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ChromeModa Solutions

Germany . 5,308 parts In-Stock

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$24.384

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$29.736

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IDEA Electronic Components Group

UK . 293 parts In-Stock

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$29.736

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$28.249

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$26.762

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293

$29.736

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$26.762

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One Stop Electronics

USA . 1,582 parts In-Stock

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$39.000

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Component Stockers USA

USA . 640 parts In-Stock

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$99.990

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Microchip USA

USA . 1,399 parts In-Stock

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Corphita

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Overview

Unlock the power of high-quality logic gates with the SN74AHC132DRE4 by Texas Instruments. With a legacy of excellence in manufacturing, Texas Instruments delivers a reliable product that exceeds industry standards. Ideal for automotive applications and beyond, this versatile logic gate offers fast propagation delay and low power consumption, providing unmatched value to customers seeking efficiency and performance. Trust Texas Instruments to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 11 ns

A low propagation delay ensures fast operation and responsiveness in logic gate applications.

Surface Mount: YES

The surface-mount capability allows for easy installation and space-saving design.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional components, simplifying circuit design.

No. of Inputs: 2

Having 2 inputs allows for more complex logic operations to be performed.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a common nominal supply voltage, making it compatible with various systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stability and reliable operation in different circuit configurations.

Power Supplies (V): 2/5.5

Ability to operate within a range of power supplies increases flexibility in circuit design and compatibility.

No. of Terminals: 14

Having 14 terminals provides ample connection points for interfacing with other components or circuits.

Maximum I (ol): 8 Amp

A high maximum output current capability allows for driving of multiple loads without external buffering.

Propagation Delay (tpd): 17.5 ns

Although slightly higher, the propagation delay still falls within a reasonable range for efficient operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of applications, including automotive use.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, ensuring reliability in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish ensures reliable connections and longevity of the product.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout and soldering configuration.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact circuit layouts and minimal space requirements.

Width: 3.9 mm

Compact width enables dense packing of components on the PCB for efficient use of board space.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages, making it suitable for battery-powered applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly processes.

Length: 8.65 mm

Moderate length allows for easy placement on the PCB and flexibility in circuit layout.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, offering reliability in harsh operating conditions.

Schmitt Trigger: YES

Incorporation of a Schmitt trigger ensures signal conditioning and noise immunity in input signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering during assembly and provides mechanical stability.

Packing Method: TR

Tape and reel packaging method allows for automated pick-and-place assembly processes, saving time and labor costs.

Terminal Pitch: 1.27 mm

The specified terminal pitch provides compatibility with standard PCB layouts and facilitates easy soldering.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher supply voltages, offering versatility in different circuit applications.

Maximum Power Supply Current (ICC): 0.02 mA

Low power supply current ensures energy efficiency and reduces heat dissipation in the circuit.

Technical Specifications

Logic Gates SN74AHC132DRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AHC132DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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