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SN74AHC08PWRE4

Texas Instruments

SN74AHC08PWRE4 by Texas Instruments

SN74AHC08PWRE4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 2-5.5V, with a propagation delay of 9ns at nominal supply. This small outline package is ideal for automotive applications due to its low power consumption and wide operating temperature range from -40°C to 125°C.

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4

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1k+

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Chip Stock

USA . 38,653 parts In-Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 1,245 parts In-Stock

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$7.000

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Corohmni

South Africa . 22 parts In-Stock

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AZTECH Wire

Italy . 587 parts In-Stock

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One Stop Electronics

USA . 887 parts In-Stock

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Parana Technologies

USA . 1,358 parts In-Stock

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$18.617

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$18.715

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DigiPath Technology Company

USA . 2,090 parts In-Stock

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$20.500

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$18.860

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ChromeModa Solutions

Germany . 4,643 parts In-Stock

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IDEA Electronic Components Group

UK . 461 parts In-Stock

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Semicontronic

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Perfect Parts

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Overview

Unlock endless possibilities with the Texas Instruments SN74AHC08PWRE4 Logic Gates. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this logic gate provides seamless integration and exceptional performance. Experience the value of efficiency and precision with Texas Instruments, making complex tasks simpler and more efficient. Elevate your projects with the SN74AHC08PWRE4 and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this logic gate lightweight and durable.

Propagation Delay at Nominal Supply: 9 ns

With a fast propagation delay of 9 ns, this logic gate ensures quick operation and efficient performance.

Surface Mount: YES

Being surface mountable, this logic gate is easy to install and saves valuable PCB space.

No. of Functions: 4

This logic gate offers 4 functions in one, making it a cost-effective and space-saving solution.

No. of Inputs: 2

With 2 inputs, this logic gate is versatile for various circuit designs and configurations.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB layouts and makes integration seamless.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this logic gate is suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable operation and prevents signal degradation.

Power Supplies (V): 2/5.5

Compatible with power supplies ranging from 2V to 5.5V, this logic gate offers flexibility in different circuit setups.

No. of Terminals: 14

With 14 terminals, this logic gate provides ample connectivity options for complex circuitry.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this logic gate suitable for compact electronic devices.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this logic gate can drive high-power loads with ease.

Propagation Delay (tpd): 14 ns

The propagation delay of 14 ns ensures fast signal processing and reliable operation.

Maximum Operating Temperature: 125 °C

Operating at up to 125°C, this logic gate is ideal for high-temperature environments.

Minimum Operating Temperature: -40 °C

Able to operate at temperatures as low as -40°C, this logic gate is suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

With dual terminal positions, this logic gate allows for flexible PCB layout and routing options.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm makes this logic gate suitable for slim and compact designs.

Width: 4.4 mm

With a width of 4.4 mm, this logic gate can fit into tight spaces and crowded PCB layouts.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V, this logic gate is energy-efficient and suitable for low-power applications.

Maximum Time at Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this logic gate can withstand reflow soldering processes effectively.

Peak Reflow Temperature °C: 260

Designed to withstand peak reflow temperatures of 260°C, this logic gate is resilient to high-temperature soldering processes.

Length: 5 mm

With a length of 5 mm, this logic gate is compact and space-saving in PCB layouts.

Temperature Grade: AUTOMOTIVE

Built to automotive-grade standards, this logic gate is suitable for use in automotive electronics applications.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering for secure connections.

Packing Method: TR

The tape and reel packing method ensures convenient handling and protects the logic gate during transportation and storage.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate offers precise and compact terminal placement for efficient PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this logic gate is suitable for a wide range of voltage requirements.

Maximum Power Supply Current (ICC): 0.002 mA

Consuming a maximum power supply current of 0.002 mA, this logic gate is energy-efficient and minimizes power consumption.

Technical Specifications

Logic Gates SN74AHC08PWRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 5 V NOMINAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.002 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74AHC08PWRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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