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SN74AHC04QPWR

Texas Instruments

SN74AHC04QPWR by Texas Instruments

SN74AHC04QPWR by Texas Instruments is a logic gate with 6 functions, 8.5 ns propagation delay, and operates at a supply voltage of 3.3V. It is used in automotive applications due to its CMOS technology, dual terminal position, and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,320 parts In-Stock

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Vyrian

USA . 2,408 parts In-Stock

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2,408

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Distributors (Availability)

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AZTECH Wire

Italy . 505 parts In-Stock

1+ parts

$6.559

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505

$6.559

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Parana Technologies

USA . 354 parts In-Stock

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$9.687

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-

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$10.270

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354

$9.687

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$10.270

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DigiPath Technology Company

USA . 1,270 parts In-Stock

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$10.666

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$9.813

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1,270

$10.666

$9.813

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ChromeModa Solutions

Germany . 2,832 parts In-Stock

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$10.884

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$8.925

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2,832

$10.884

$8.925

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$10.884

100+ parts

$10.340

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$9.796

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1,181

$10.884

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$9.796

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One Stop Electronics

USA . 210 parts In-Stock

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$16.000

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210

$16.000

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Component Stockers USA

USA . 204 parts In-Stock

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$99.990

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Corphita

USA . 1,823 parts In-Stock

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Microchip USA

USA . 380 parts In-Stock

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Overview

Unlock the power of efficient logic gates with the SN74AHC04QPWR by Texas Instruments. Crafted with precision and expertise, Texas Instruments delivers top-notch quality in every component. Ideal for a wide range of applications, this logic gate is designed to enhance performance and reliability. With a nominal supply voltage of 3.3V and fast propagation delay, this product offers unmatched value and benefits to customers seeking high-quality solutions. Trust Texas Instruments for innovative technology that delivers exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to heat, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast signal processing, making this product efficient for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 6

Multiple functions in a single component offer versatility and integration potential for different circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, compatible with many electronic systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable operation and reduced signal distortion.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages, enhancing compatibility with different systems.

No. of Terminals: 14

Sufficient terminals for connectivity and signal routing within the circuit.

Maximum I (ol): 8 Amp

High output current capability allows for driving various loads without external amplification.

Propagation Delay (tpd): 13 ns

Low propagation delay ensures efficient signal processing and high-speed operation.

Maximum Operating Temperature: 125 °C

Wide temperature range tolerance makes this product suitable for diverse operating environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for reliable connections and long-term performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and component placement.

Maximum Seated Height: 1.2 mm

Low profile design allows for compact and space-saving installations.

Width: 4.4 mm

Compact width design for efficient use of PCB space.

Minimum Supply Voltage (Vsup): 2 V

Supports low supply voltage operation for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for extended periods during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering and assembly.

Length: 5 mm

Compact length design for efficient use of PCB space.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance for reliable performance in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and secure solder connections.

Packing Method: TR

Tape and reel packing method for convenient storage, handling, and automated assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and high-density integration on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a high supply voltage range for flexibility in power supply configurations.

Technical Specifications

Logic Gates SN74AHC04QPWR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74AHC04QPWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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