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SN74ABT8646DWRG4

Texas Instruments

SN74ABT8646DWRG4 by Texas Instruments

SN74ABT8646DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.5 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperatures from -40 to 85°C, with independent control and positive edge trigger type for bidirectional communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,710 parts In-Stock

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6,710

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Digiode

USA . 4,201 parts In-Stock

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4,201

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Distributors (Availability)

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Andel Nordic

Denmark . 1,215 parts In-Stock

1+ parts

$6.033

100+ parts

-

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$5.792

10k+ parts

$5.792

1,215

$6.033

-

$5.792

$5.792

AZTECH Wire

Italy . 236 parts In-Stock

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$7.868

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236

$7.868

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Parana Technologies

USA . 336 parts In-Stock

1+ parts

$11.623

100+ parts

-

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$12.019

10k+ parts

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336

$11.623

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$12.019

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ChromeModa Solutions

Germany . 1,033 parts In-Stock

1+ parts

$13.060

100+ parts

$10.709

1k+ parts

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1,033

$13.060

$10.709

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IDEA Electronic Components Group

UK . 487 parts In-Stock

1+ parts

$13.060

100+ parts

$12.407

1k+ parts

$11.754

10k+ parts

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487

$13.060

$12.407

$11.754

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One Stop Electronics

USA . 678 parts In-Stock

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$51.000

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678

$51.000

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Corphita

USA . 2,444 parts In-Stock

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2,444

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DigiPath Technology Company

USA . 361 parts In-Stock

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$11.775

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361

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$11.775

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Microchip USA

USA . 268 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ABT8646DWRG4 from Texas Instruments, a leading manufacturer known for its top-quality components. This bus driver & transceiver offers fast propagation delay and 3-STATE output characteristics, making it ideal for a wide range of applications. With a small outline package style and dual terminal position, this product provides convenience and versatility to customers. Trust in Texas Instruments' expertise and choose the SN74ABT8646DWRG4 for reliable performance and seamless integration into your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product, making it suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Bits: 8

Having 8 bits allows for versatile data transmission and processing capabilities, making this product suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, ensuring compatibility with most systems and ease of integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in demanding applications.

Technology: BICMOS

Utilizing BICMOS technology offers a balance between high-speed performance and low power consumption, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74ABT8646DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL; MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74ABT8646DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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