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SN74ABT8543DWRG4

Texas Instruments

SN74ABT8543DWRG4 by Texas Instruments

SN74ABT8543DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.5 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85°C) and supports bidirectional count direction, making it ideal for various applications requiring independent control of two ports.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,867 parts In-Stock

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Digiode

USA . 2,399 parts In-Stock

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AZTECH Wire

Italy . 397 parts In-Stock

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$12.638

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Parana Technologies

USA . 1,072 parts In-Stock

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$21.989

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$22.524

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DigiPath Technology Company

USA . 205 parts In-Stock

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$24.213

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ChromeModa Solutions

Germany . 5,856 parts In-Stock

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$24.707

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$20.260

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IDEA Electronic Components Group

UK . 1,710 parts In-Stock

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$24.707

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$23.472

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$22.236

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One Stop Electronics

USA . 1,641 parts In-Stock

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$44.000

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Component Stockers USA

USA . 776 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Unlock the power of seamless data transmission with the SN74ABT8543DWRG4 from Texas Instruments. This high-quality Bus Driver & Transceiver offers unparalleled reliability and efficiency, making it an essential component for a wide range of applications. With a nominal supply voltage of 5V and a propagation delay of just 5.5ns, this product delivers fast and precise results every time. Whether you're working on industrial automation or telecommunications projects, this versatile device provides the performance and value you need to succeed. Upgrade your systems today with the SN74ABT8543DWRG4 and experience the difference Texas Instruments can make for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes installation easy and allows for space-saving on PCB layouts.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Maximum I (ol): 64 Amp

Can handle high output current, making it suitable for driving buses and transceivers with varying power requirements.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, ensuring reliability in diverse operating conditions.

Technology: BICMOS

Utilizes Bipolar-CMOS technology for high-speed performance and low power consumption, ideal for efficient data transmission.

Technical Specifications

Bus Driver & Transceivers SN74ABT8543DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ABT8543DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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