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SN74ABT2245DWRE4

Texas Instruments

SN74ABT2245DWRE4 by Texas Instruments

SN74ABT2245DWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns at 5V, suitable for bidirectional applications. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max supply voltage of 5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,268 parts In-Stock

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Digiode

USA . 551 parts In-Stock

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551

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Distributors (Availability)

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Andel Nordic

Denmark . 5,471 parts In-Stock

1+ parts

$3.859

100+ parts

-

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$3.704

10k+ parts

$3.704

5,471

$3.859

-

$3.704

$3.704

AZTECH Wire

Italy . 874 parts In-Stock

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$8.727

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874

$8.727

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One Stop Electronics

USA . 801 parts In-Stock

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$21.000

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801

$21.000

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Parana Technologies

USA . 354 parts In-Stock

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$29.805

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$63.441

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354

$29.805

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$63.441

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DigiPath Technology Company

USA . 105 parts In-Stock

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$32.819

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105

$32.819

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ChromeModa Solutions

Germany . 4,824 parts In-Stock

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$33.489

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$27.461

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4,824

$33.489

$27.461

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IDEA Electronic Components Group

UK . 2,373 parts In-Stock

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$33.489

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$31.815

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$30.140

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Component Stockers USA

USA . 643 parts In-Stock

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$99.990

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Corphita

USA . 3,890 parts In-Stock

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Microchip USA

USA . 2,467 parts In-Stock

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Overview

Unlock seamless data transmission with the Texas Instruments SN74ABT2245DWRE4 Bus Driver & Transceiver. Crafted with precision and expertise, this top-tier component ensures reliable performance in a variety of applications. From industrial automation to telecommunications, this product guarantees fast propagation delays and low power consumption, making it a valuable investment for your projects. Trust Texas Instruments for quality, trust the SN74ABT2245DWRE4 for unparalleled efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 4.5 ns

With a low propagation delay, this product ensures fast and efficient data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product can be easily integrated into existing systems without the need for additional power regulation.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor provides flexibility in controlling signal flow, allowing for efficient management of data transmission.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74ABT2245DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ABT2245DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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