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SN74ABT162245DL

Texas Instruments

SN74ABT162245DL by Texas Instruments

SN74ABT162245DL by Texas Instruments is a bus driver & transceiver with 8 bits, 5.1 ns propagation delay, and 3-state output. It operates at a nominal voltage of 5V and has a load capacitance of 50 pF. Ideal for bidirectional control applications in industrial settings due to its compact size and high-speed performance.

Median Price

$1.313

Lifecycle Status

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Texas Instruments

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Mouser Electronics

USA . 283 parts In-Stock

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Rochester

USA . 7,506 parts In-Stock

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DigiKey

USA . 7,506 parts In-Stock

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Verical

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Arrow

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Digiode

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TEDSS.com

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Chip Stock

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Bristol Electronics

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Vicor Industries, Inc.

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Elcom Components

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Resion

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Right Parts Inc.

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EMSNET

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Component Stockers USA

USA . 10,119 parts In-Stock

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Corphita

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Denmark . 4,706 parts In-Stock

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Parana Technologies

USA . 990 parts In-Stock

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DigiPath Technology Company

USA . 2,089 parts In-Stock

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ChromeModa Solutions

Germany . 3,176 parts In-Stock

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

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ChipTracer

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Overview

Elevate your electronic designs with the SN74ABT162245DL from Texas Instruments, a leading manufacturer in the industry. Perfect for Bus Driver & Transceiver applications, this high-quality product offers fast propagation delay and 3-state output characteristics. With a compact rectangular package design and dual terminal position, this versatile component provides customers with reliable performance and easy installation. Trust Texas Instruments to deliver exceptional value and innovation for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Propagation Delay At Nominal Supply: 5.1 ns

Low propagation delay ensures fast data transmission within the bus driver.

Surface Mount: YES

Ease of installation and compact design for space-saving in electronic circuits.

No. of Functions: 2

Ability to perform multiple functions in a single component, reducing the overall circuit complexity.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with most electronic systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal transmission.

Power Supplies (V): 5

Consistent power supply for stable and reliable operation.

Maximum I (ol): 64 Amp

High output current capability for driving bus lines with heavy loads.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output allows for tristate control, and the series resistor helps in signal integrity.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range.

Technical Specifications

Bus Driver & Transceivers SN74ABT162245DL attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

5.1 ns

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74ABT162245DL Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-495-0404, 5962014950404

NIIN

014950404

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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