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SN54S112J

Texas Instruments

SN54S112J by Texas Instruments

SN54S112J by Texas Instruments is a TTL technology latch with 2 functions, 7ns propagation delay, and 15pF load capacitance. It operates at a supply voltage of 5V and has a max frequency of 80MHz. Ideal for military-grade applications requiring fast response times in a compact IN-LINE package.

Median Price

$11.786

Lifecycle Status

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Freelance Electronics

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Digiode

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AZTECH Wire

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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Overview

Unleash the power of innovation with the SN54S112J by Texas Instruments, a cutting-edge latches & flip-flops device that redefines reliability and performance. Crafted with precision using top-notch materials, this product offers customers unparalleled quality and value. With a wide range of applications in various industries, the SN54S112J is designed to deliver seamless operation and efficiency. Embrace the future of technology with Texas Instruments and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability in harsh operating conditions.

Propagation Delay At Nominal Supply: 7 ns

Fast propagation delay helps in quick response time and efficient operation.

No. of Functions: 2

Having multiple functions in one device increases functionality and saves space.

Nominal Supply Voltage / Vsup (V): 5

This common supply voltage makes integration with other components easier.

Maximum I (ol): 20 Amp

High output current capability allows for driving demanding loads.

Trigger Type: NEGATIVE EDGE

Negative edge trigger provides precise control over the timing of operations.

Technology: TTL

TTL technology offers robust performance and compatibility with various systems.

Technical Specifications

Latches & Flip-Flops SN54S112J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-CDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

125 MHz

Trade Compliance

SN54S112J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-547-6683, 5962005476683, 5962-01-016-5308, 5962010165308, 5962-00-481-9362, 5962004819362

NIIN

005476683, 010165308, 004819362

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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