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S5LS20216ASPGEMEP

Texas Instruments

S5LS20216ASPGEMEP by Texas Instruments

Texas Instruments S5LS20216ASPGEMEP is a 32-bit microcontroller with 22-bit address bus, 8-bit data RAM width, and 1.65V max supply voltage. Ideal for military applications, it features MIL-Grade temp range (-55 to 125 °C), ADC (24-Ch 12-Bit), and connectivity options like CAN(3) and UART(2).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,383 parts In-Stock

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Digiode

USA . 1,898 parts In-Stock

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1,898

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Distributors (Availability)

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AZTECH Wire

Italy . 288 parts In-Stock

1+ parts

$10.004

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288

$10.004

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One Stop Electronics

USA . 408 parts In-Stock

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$23.000

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408

$23.000

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Parana Technologies

USA . 1,269 parts In-Stock

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$69.135

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$6,420.252

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$62.222

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1,269

$69.135

$6,420.252

$62.222

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DigiPath Technology Company

USA . 856 parts In-Stock

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$76.126

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856

$76.126

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ChromeModa Solutions

Germany . 3,127 parts In-Stock

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$77.680

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$63.698

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3,127

$77.680

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IDEA Electronic Components Group

UK . 329 parts In-Stock

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$77.680

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$73.796

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$69.912

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329

$77.680

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$69.912

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Microchip USA

USA . 2,714 parts In-Stock

1+ parts

$115.890

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$113.870

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$112.870

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$111.860

2,714

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$111.860

Corphita

USA . 3,225 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the S5LS20216ASPGEMEP microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. This microcontroller is versatile, making it ideal for a wide range of applications. With its advanced features and cutting-edge technology, this microcontroller offers unmatched value and benefits to customers. Trust Texas Instruments for all your microcontroller needs and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.65 V

The maximum supply voltage of 1.65 V allows for efficient power usage and helps in preventing any damage to the microcontroller due to overvoltage.

Address Bus Width: 22

With a wider address bus width of 22, the microcontroller can access a larger memory space, enabling it to handle more complex tasks and operations effectively.

No. of Terminals: 144

Having 144 terminals provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile in different applications.

Minimum Operating Temperature: -55 °C

The wide range of minimum operating temperature (-55 °C) ensures the microcontroller can operate in harsh environments and extreme conditions without any performance issues.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, facilitating accurate and precise measurement in various sensor-based applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it offers high-performance computing capabilities with reduced instruction set complexity, making it ideal for embedded systems and IoT applications.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V ensures stable and consistent power delivery to the microcontroller, contributing to its reliable operation and performance.

Connectivity: CAN(3), LIN, SPI(3), UART(2)

The multiple connectivity options such as CAN, LIN, SPI, and UART enable seamless communication with a wide range of external devices and networks, enhancing the versatility and flexibility of the microcontroller.

Technical Specifications

Microcontrollers S5LS20216ASPGEMEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

115

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

167772160

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

140 rpm

Maximum Supply Current:

580 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), LIN, SPI(3), UART(2)

Peripherals:

CRC, DMA(16), TIMER(32), WDT

Analog To Digital Convertors:

24-Ch 12-Bit (2)

Trade Compliance

S5LS20216ASPGEMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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