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S5LS20216ASPGEQQ1

Texas Instruments

S5LS20216ASPGEQQ1 by Texas Instruments

Texas Instruments' S5LS20216ASPGEQQ1 microcontroller features 32-bit CPU, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications with peripherals like CRC, DMA(16), TIMER(32), WDT and connectivity options such as CAN, SCI(2), SPI(3), UART(2). Operating at up to 20 MHz clock frequency in a compact package style of flatpack with low profile.

Median Price

$54.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 280 parts In-Stock

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$54.190

100+ parts

$40.413

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$39.284

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280

$54.190

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$39.284

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Distributors (In-Stock)

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Digiode

USA . 661 parts In-Stock

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$40.916

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Vyrian

USA . 2,488 parts In-Stock

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Chip Stock

USA . 879 parts In-Stock

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Semtec, LLC

USA . 116 parts In-Stock

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Nova Conductors

Japan . 87 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 29 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 493 parts In-Stock

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$17.557

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$17.557

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Ampacity Inc.

Singapore . 220 parts In-Stock

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$36.610

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220

$36.610

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Semicontronic

India . 220 parts In-Stock

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$36.610

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$35.695

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$35.512

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$36.610

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$35.512

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Corphita

USA . 4,690 parts In-Stock

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$38.763

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$51.719

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$49.133

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$49.133

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900

$51.719

$49.133

$49.133

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Parana Technologies

USA . 758 parts In-Stock

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$75.625

100+ parts

$7,022.936

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$68.063

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758

$75.625

$7,022.936

$68.063

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DigiPath Technology Company

USA . 960 parts In-Stock

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$83.273

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ChromeModa Solutions

Germany . 1,292 parts In-Stock

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$84.972

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$69.677

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IDEA Electronic Components Group

UK . 668 parts In-Stock

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$84.972

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$80.723

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$76.475

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668

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Corohmni

South Africa . 347 parts In-Stock

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Microchip USA

USA . 2,006 parts In-Stock

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$92.210

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$90.600

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$89.800

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$89.000

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$89.000

Lixinc

USA . 7,859 parts In-Stock

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Continental Prestige Electronics

USA . 5,088 parts In-Stock

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Argo Parts USA

USA . 4,894 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 1,775 parts In-Stock

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Perfect Parts

USA . 450 parts In-Stock

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Overview

Unlock endless possibilities with the S5LS20216ASPGEQQ1 microcontroller by Texas Instruments. Crafted with precision and reliability, this device offers a wide range of applications in various industries, from automotive to consumer electronics. Experience seamless connectivity and enhanced performance with features like DMA channels and CRC peripherals. Designed for low power consumption and high-speed operation, this microcontroller provides unmatched value and benefits to customers seeking cutting-edge solutions. Elevate your projects with the quality and advantages that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility for the microcontroller, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and improving assembly processes.

Maximum Supply Voltage: 1.65 V

With a low maximum supply voltage, this microcontroller is energy-efficient and reduces the risk of damage from voltage spikes.

On Chip Data RAM Width: 8

The wide data RAM width enhances data processing speed and efficiency, making the microcontroller ideal for high-performance tasks.

Address Bus Width: 22

A wide address bus width allows for efficient memory addressing, increasing the overall speed and performance of the microcontroller.

Screening Level: AEC-Q100

This screening level ensures the microcontroller meets automotive industry standards for reliability and quality.

Package Shape: SQUARE

The square package shape allows for easy integration into various circuit board layouts, optimizing space and design flexibility.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and capabilities, making this microcontroller suitable for complex applications.

Power Supplies (V): 1.5,3.3

This microcontroller supports multiple power supply voltages, offering flexibility and compatibility with different system requirements.

No. of Terminals: 144

The high number of terminals allows for versatile connectivity options, making the microcontroller suitable for diverse interfaces and peripherals.

Technical Specifications

Microcontrollers S5LS20216ASPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

8

No. of I/O Lines:

68

No. of Serial I/Os:

9

No. of Terminals:

144

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Bytes:

163840

RAM Words:

160

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

140 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

540 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, SCI(2), SPI(3), UART(2)"

Peripherals:

"CRC, DMA(16), TIMER(32), WDT"

Trade Compliance

S5LS20216ASPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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