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S5LS10206ASZWTQQ1

Texas Instruments

S5LS10206ASZWTQQ1 by Texas Instruments

Texas Instruments S5LS10206ASZWTQQ1 microcontroller features 32-bit CPU, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications with peripherals like CRC, DMA(16), TIMER(32), WDT and connectivity options such as CAN, SCI(2), SPI(3), UART(2). Operates at up to 20 MHz clock frequency in a low power mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,909 parts In-Stock

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Digiode

USA . 234 parts In-Stock

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One Stop Electronics

USA . 920 parts In-Stock

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$7.000

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920

$7.000

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AZTECH Wire

Italy . 373 parts In-Stock

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$13.247

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Parana Technologies

USA . 2,038 parts In-Stock

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$75.454

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Microchip USA

USA . 1,862 parts In-Stock

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$76.410

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$75.080

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$74.420

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$73.750

1,862

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$75.080

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$73.750

DigiPath Technology Company

USA . 1,037 parts In-Stock

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$83.084

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$76.438

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1,037

$83.084

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ChromeModa Solutions

Germany . 4,433 parts In-Stock

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$84.780

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$69.520

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$84.780

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IDEA Electronic Components Group

UK . 111 parts In-Stock

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$84.780

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$80.541

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$76.302

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QUARKTWIN TECHNOLOGY LTD

USA . 25,349 parts In-Stock

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Corphita

USA . 1,642 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the S5LS10206ASZWTQQ1 microcontroller by Texas Instruments. This high-quality device boasts superior performance and reliability, making it ideal for a wide range of applications in the automotive industry and beyond. With features like low power mode, peripheral connectivity options, and extensive RAM capacity, this microcontroller offers unmatched value and versatility to customers. Trust Texas Instruments for top-of-the-line solutions that drive innovation and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Maximum Supply Voltage: 1.65 V

Allows for flexibility in power supply options while maintaining efficiency.

Address Bus Width: 22

Provides a wide address range for memory access and data processing.

Bit Size: 32

Offers a high-level of processing capability for complex tasks and algorithms.

CPU Family: CORTEX-R4F

Part of the advanced Cortex-R series, known for high performance and reliability in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and fast processing of instructions.

Maximum Clock Frequency: 20 MHz

Operates at a high clock speed for swift execution of tasks and operations.

Analog To Digital Convertors: 24-Ch 12-Bit

Offers a high number of ADC channels with 12-bit resolution for accurate analog-to-digital conversion.

Connectivity: CAN, SCI(2), SPI(3), UART(2)

Supports a variety of communication protocols for seamless integration with different peripherals and devices.

Technical Specifications

Microcontrollers S5LS10206ASZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

8

No. of I/O Lines:

115

No. of Serial I/Os:

9

No. of Terminals:

337

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Bytes:

163840

RAM Words:

160

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

580 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, SCI(2), SPI(3), UART(2)"

Peripherals:

"CRC, DMA(16), TIMER(32), WDT"

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

S5LS10206ASZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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