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S5LS20206ASPGEQQ1

Texas Instruments

S5LS20206ASPGEQQ1 by Texas Instruments

Texas Instruments' S5LS20206ASPGEQQ1 microcontroller features 32-bit architecture, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications with peripherals like CRC, DMA(16), TIMER(32), WDT and connectivity options including CAN, SCI(2), SPI(3), UART(2). Operating temperature ranges from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,393 parts In-Stock

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Digiode

USA . 3,651 parts In-Stock

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Inventory MP

USA . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 394 parts In-Stock

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$9.637

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One Stop Electronics

USA . 1,396 parts In-Stock

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$20.000

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Parana Technologies

USA . 1,788 parts In-Stock

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$35.781

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ChromeModa Solutions

Germany . 6,603 parts In-Stock

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$40.203

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$32.966

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

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$40.203

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$38.193

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$36.183

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Microchip USA

USA . 282 parts In-Stock

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$103.290

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$102.390

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$102.390

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$101.500

282

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$101.500

QUARKTWIN TECHNOLOGY LTD

USA . 4,002 parts In-Stock

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Corphita

USA . 2,943 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 391 parts In-Stock

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DigiPath Technology Company

USA . 311 parts In-Stock

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Overview

Unleash the power of innovation with the S5LS20206ASPGEQQ1 by Texas Instruments. Crafted with precision and quality, this microcontroller opens up a world of possibilities in automotive applications, offering unparalleled performance and reliability. With advanced features such as CRC, DMA, TIMER, and WDT, this device delivers exceptional value to customers seeking cutting-edge solutions. Experience seamless connectivity with CAN, SCI, SPI, and UART interfaces, while enjoying low power modes for enhanced efficiency. Elevate your projects with the S5LS20206ASPGEQQ1 and redefine what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 1.65 V

Allows for flexible power supply options while operating efficiently within the specified voltage range.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance and reliability for demanding applications, ensuring smooth operation.

RAM Bytes: 163840

With a large RAM capacity, this microcontroller can handle multitasking and memory-intensive operations effectively.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it provides efficient processing and improved performance for various functions.

Connectivity: CAN, SCI(2), SPI(3), UART(2)

Versatile connectivity options allow for seamless integration with other devices, facilitating data exchange and communication.

Technical Specifications

Microcontrollers S5LS20206ASPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

8

No. of I/O Lines:

68

No. of Serial I/Os:

9

No. of Terminals:

144

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Bytes:

163840

RAM Words:

160

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

140 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

540 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, SCI(2), SPI(3), UART(2)"

Peripherals:

"CRC, DMA(16), TIMER(32), WDT"

Trade Compliance

S5LS20206ASPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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