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S5LS20206ASZWTQQ1

Texas Instruments

S5LS20206ASZWTQQ1 by Texas Instruments

Texas Instruments S5LS20206ASZWTQQ1 microcontroller features 32-bit CPU, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications with peripherals like CRC, DMA(16), TIMER(32), WDT. Operates at max clock frequency of 20 MHz with low power mode and ADC channels for efficient performance.

Median Price

$26.220

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 771 parts In-Stock

1+ parts

$26.220

100+ parts

$25.700

1k+ parts

$25.170

10k+ parts

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771

$26.220

$25.700

$25.170

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Distributors (In-Stock)

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Vyrian

USA . 5,149 parts In-Stock

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5,149

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Digiode

USA . 2,392 parts In-Stock

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2,392

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Distributors (Availability)

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AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$6.414

100+ parts

-

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709

$6.414

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One Stop Electronics

USA . 1,214 parts In-Stock

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$25.000

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1,214

$25.000

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Parana Technologies

USA . 381 parts In-Stock

1+ parts

$25.079

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$25.755

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381

$25.079

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$25.755

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DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$27.615

100+ parts

$25.406

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1,761

$27.615

$25.406

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ChromeModa Solutions

Germany . 4,389 parts In-Stock

1+ parts

$28.179

100+ parts

$23.107

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4,389

$28.179

$23.107

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IDEA Electronic Components Group

UK . 224 parts In-Stock

1+ parts

$28.179

100+ parts

$26.770

1k+ parts

$25.361

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224

$28.179

$26.770

$25.361

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Microchip USA

USA . 2,498 parts In-Stock

1+ parts

$78.700

100+ parts

$77.330

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$76.650

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$75.960

2,498

$78.700

$77.330

$76.650

$75.960

Component Stockers USA

USA . 343 parts In-Stock

1+ parts

$99.990

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343

$99.990

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Lixinc

USA . 17,366 parts In-Stock

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17,366

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,623 parts In-Stock

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Overview

Elevate your automotive applications with the S5LS20206ASZWTQQ1 by Texas Instruments. This high-quality microcontroller offers unparalleled performance and reliability, featuring a wide range of peripherals such as CRC, DMA, TIMER, and WDT. With its advanced technology and low power mode, this product ensures optimal efficiency and seamless connectivity through CAN, SCI, SPI, and UART interfaces. Trust in Texas Instruments for cutting-edge solutions that deliver value and innovation to customers across various industries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Ease of installation and space-saving design with surface mount capability.

Maximum Supply Voltage: 1.65 V

Efficient power management with a low maximum supply voltage.

On Chip Data RAM Width: 8

Efficient data processing with a wide on-chip data RAM width.

Address Bus Width: 22

Enhanced address bus width for effective memory addressing.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability.

Package Shape: SQUARE

Space-efficient square package shape for compact designs.

Bit Size: 32

High processing capability with a 32-bit architecture.

Power Supplies (V): 1.5,3.3

Versatile power supply options for different voltage requirements.

No. of Terminals: 337

Sufficient terminals for connectivity and I/O operations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Advanced package style for efficient PCB layout and performance.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatility in different environments.

CPU Family: CORTEX-R4F

High-performance Cortex-R4F CPU family for processing capabilities.

No. of External Interrupts: 8

Sufficient external interrupts for responsive system interactions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range for reliable performance in extreme conditions.

Terminal Finish: TIN SILVER COPPER

Durable terminal finish for long-lasting connectivity.

ADC Channels: YES

Integrated ADC channels for analog input capabilities.

DMA Channels: YES

DMA channels for efficient data transfer and processing.

Terminal Position: BOTTOM

Bottom terminal position for easy PCB integration.

ROM Words: 2097152

Large ROM capacity for storing program instructions.

RAM Words: 160

Sufficient RAM capacity for data storage and processing.

Width: 16 mm

Compact width for space-saving product designs.

Boundary Scan: YES

Boundary scan feature for testing and debugging operations.

External Data Bus Width: 16

Wide external data bus width for efficient data transfer.

Peripherals: CRC, DMA(16), TIMER(32), WDT

Integrated peripherals for enhanced functionality and system control.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Optimum reflow temperature management for component longevity.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance for robust assembly processes.

Length: 16 mm

Compact length for space-efficient product designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance for reliable performance in vehicle applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller for efficient and streamlined processing.

No. of Timers: 32

Multiple timers for precise timing and control functions.

RAM Bytes: 163840

Large RAM capacity in bytes for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high performance.

Terminal Form: BALL

Ball terminal form for secure and reliable connections.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog-to-digital conversion.

Maximum Supply Current: 580 mA

Sufficient supply current for powering various components and peripherals.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage for consistent performance.

No. of DMA Channels: 16

Multiple DMA channels for efficient data transfer and processing.

No. of Serial I/Os: 9

Multiple serial I/Os for versatile communication interfaces.

Connectivity: CAN, SCI(2), SPI(3), UART(2)

Multiple connectivity options for versatile communication protocols.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and flexibility.

Terminal Pitch: 0.8 mm

Fine terminal pitch for precise connections and compact layout.

Format: FLOATING POINT

Floating point format for accurate mathematical calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 component for moderate moisture sensitivity during handling and storage.

Speed: 160 rpm

High speed performance for efficient data processing and system responsiveness.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Efficient on-chip program ROM width for program storage and execution.

No. of I/O Lines: 115

Multiple I/O lines for versatile interfacing and connectivity options.

Technical Specifications

Microcontrollers S5LS20206ASZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

8

No. of I/O Lines:

115

No. of Serial I/Os:

9

No. of Terminals:

337

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Bytes:

163840

RAM Words:

160

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

580 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, SCI(2), SPI(3), UART(2)"

Peripherals:

"CRC, DMA(16), TIMER(32), WDT"

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

S5LS20206ASZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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