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S5LS20216ASGWTMEP

Texas Instruments

S5LS20216ASGWTMEP by Texas Instruments

Texas Instruments S5LS20216ASGWTMEP microcontroller features 32-bit CPU, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for military applications with MIL-STD temperature range, it offers peripherals like CRC, DMA(16), TIMER(32), WDT for robust system integration at up to 20 MHz clock frequency.

Median Price

$48.663

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Texas Instruments

USA . 82 parts In-Stock

1+ parts

$50.856

100+ parts

$45.205

1k+ parts

$33.239

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82

$50.856

$45.205

$33.239

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Chip1Stop

Japan . 90 parts In-Stock

1+ parts

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100+ parts

$46.470

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90

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$46.470

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Distributors (In-Stock)

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Digiode

USA . 3,153 parts In-Stock

1+ parts

$48.313

100+ parts

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3,153

$48.313

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Vyrian

USA . 4,661 parts In-Stock

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4,661

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Distributors (Availability)

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$20.040

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755

$20.040

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Parana Technologies

USA . 718 parts In-Stock

1+ parts

$42.472

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718

$42.472

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Corphita

USA . 3,761 parts In-Stock

1+ parts

$45.770

100+ parts

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3,761

$45.770

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ChromeModa Solutions

Germany . 3,117 parts In-Stock

1+ parts

$47.721

100+ parts

$39.131

1k+ parts

-

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3,117

$47.721

$39.131

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

1+ parts

$47.721

100+ parts

$45.335

1k+ parts

$42.949

10k+ parts

-

1,938

$47.721

$45.335

$42.949

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DigiPath Technology Company

USA . 2,266 parts In-Stock

1+ parts

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100+ parts

$43.025

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2,266

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$43.025

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Overview

Experience superior performance and reliability with the S5LS20216ASGWTMEP microcontroller from Texas Instruments. Designed with cutting-edge technology, this microcontroller offers a wide range of applications in various industries. With advanced features like low power mode, high clock frequency, and multiple connectivity options, this product provides unmatched value and benefits to customers. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects to new heights with the S5LS20216ASGWTMEP microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount option allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.65 V

Low maximum supply voltage helps in reducing power consumption and extending battery life in portable devices.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits allows for efficient data processing and storage within the microcontroller.

Address Bus Width: 22

Wide address bus width of 22 bits enables the microcontroller to access a larger memory space, improving overall performance.

Package Shape: SQUARE

Square package shape ensures easy handling and placement of the microcontroller on the circuit board, optimizing space utilization.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, allowing for faster and more complex operations to be carried out efficiently.

No. of Terminals: 337

Having a high number of terminals enables a greater degree of connectivity options and flexibility when interfacing with external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design offers high density packaging for space-constrained applications.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage allows for operation in low-power environments, making the microcontroller suitable for energy-efficient devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it ideal for industrial applications.

CPU Family: CORTEX-R4F

Belonging to the Cortex-R4F CPU family ensures high performance and efficient processing capabilities for demanding real-time applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for the microcontroller to operate in extreme cold conditions without compromising performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and robust connections, ensuring reliable electrical contacts with the microcontroller.

ADC Channels: YES

Integrated ADC channels enable analog to digital conversion directly on the microcontroller, simplifying sensor interfacing and data acquisition.

DMA Channels: YES

Having DMA channels allows for efficient data transfer and handling, offloading the CPU and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout design and soldering, enhancing overall assembly process.

ROM Words: 2097152

Large ROM storage capacity of 2097152 words provides ample space for program storage, enabling complex algorithms and applications to be implemented.

Maximum Seated Height: 1.4 mm

Low maximum seated height ensures minimal vertical space usage, making it suitable for slim and compact electronic devices.

Width: 16 mm

Compact width dimension of 16 mm allows for easy integration into various PCB layouts, saving space and enabling more versatile designs.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging of the microcontroller, leading to improved reliability and faster time-to-market for products.

External Data Bus Width: 16

Having an external data bus width of 16 bits allows for efficient data transfer between the microcontroller and external memory devices.

Peripherals: CRC, DMA(16), TIMER(32), WDT

Rich set of peripherals including CRC, DMA, timers, and watchdog timer enhances the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 20 MHz

Maximum clock frequency of 20 MHz ensures high-speed operation and swift execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 20

Having a maximum time at peak reflow temperature of 20 seconds ensures proper soldering and component reliability during manufacturing processes.

Peak Reflow Temperature °C: 220

Peak reflow temperature of 220°C enables reliable soldering of the microcontroller onto the PCB, ensuring strong and durable connections.

Length: 16 mm

Compact length dimension of 16 mm allows for efficient use of space on the PCB, enabling more streamlined and compact electronic designs.

Temperature Grade: MILITARY

Military-grade temperature grade ensures ruggedness and reliability in harsh operating environments, making the microcontroller suitable for defense and aerospace applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture ensures efficient processing and low power consumption, making it ideal for embedded systems and IoT devices.

No. of Timers: 32

Abundance of timer channels allows for precise timekeeping and event scheduling capabilities, adding versatility to the microcontroller for various applications.

RAM Bytes: 167772160

Having a large RAM capacity of 167772160 bytes enables efficient data storage and manipulation within the microcontroller, supporting complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term operation.

Terminal Form: BALL

Ball terminal form provides secure electrical connections and allows for efficient soldering onto the PCB, ensuring robust and reliable operation.

Analog To Digital Convertors: 24-Ch 12-Bit (2)

Having 24-channel 12-bit ADCs provides high-resolution analog-to-digital conversion capabilities, enabling accurate and precise sensor data acquisition.

Maximum Supply Current: 580 mA

Maximum supply current of 580 mA ensures sufficient power delivery for the microcontroller and connected peripherals, supporting stable and reliable operation.

Nominal Supply Voltage: 1.5 V

Nominal supply voltage of 1.5 V offers a balanced voltage level for optimal performance and power efficiency, suitable for a wide range of applications.

No. of DMA Channels: 16

Having 16 DMA channels allows for efficient data transfer and handling, improving system performance and freeing up CPU resources for other tasks.

No. of Serial I/Os: 7

Availability of 7 serial I/O interfaces enables versatile communication options with external devices, enhancing connectivity and data exchange capabilities.

PWM Channels: YES

Integrated PWM channels provide precise control over the output signals, making the microcontroller suitable for applications requiring accurate pulse-width modulation.

Connectivity: CAN(3), LIN, SPI(3), UART(2)

Versatile connectivity options including CAN, LIN, SPI, and UART interfaces enable seamless communication with different devices and networks, enhancing overall system integration.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updating of program code, enabling flexibility and adaptability for evolving application requirements.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm enables high-density mounting and precise soldering, ensuring reliable electrical connections and efficient PCB layout.

Format: FLOATING POINT

Support for floating-point format enables accurate numerical calculations and mathematical operations, making the microcontroller suitable for computation-intensive tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the microcontroller's resistance to moisture-related damage during storage and handling, ensuring long-term reliability.

Technical Specifications

Microcontrollers S5LS20216ASGWTMEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

115

No. of Serial I/Os:

7

No. of Terminals:

337

No. of Timers:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Bytes:

167772160

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

160 rpm

Maximum Supply Current:

580 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), LIN, SPI(3), UART(2)

Peripherals:

CRC, DMA(16), TIMER(32), WDT

Analog To Digital Convertors:

24-Ch 12-Bit (2)

Trade Compliance

S5LS20216ASGWTMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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