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S5LS20206ASPGEQQ1R

Texas Instruments

S5LS20206ASPGEQQ1R by Texas Instruments

Texas Instruments S5LS20206ASPGEQQ1R is a 32-bit microcontroller with 22-bit address bus width, operating at up to 20 MHz. Ideal for automotive applications, it features ADC and DMA channels, with a temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,230 parts In-Stock

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Digiode

USA . 808 parts In-Stock

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808

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Distributors (Availability)

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AZTECH Wire

Italy . 886 parts In-Stock

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$10.619

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886

$10.619

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One Stop Electronics

USA . 762 parts In-Stock

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$12.000

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762

$12.000

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Parana Technologies

USA . 541 parts In-Stock

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$39.484

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541

$39.484

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DigiPath Technology Company

USA . 182 parts In-Stock

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$43.477

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$39.999

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182

$43.477

$39.999

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ChromeModa Solutions

Germany . 737 parts In-Stock

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$44.364

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$36.378

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737

$44.364

$36.378

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IDEA Electronic Components Group

UK . 239 parts In-Stock

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$44.364

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$42.146

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$39.928

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239

$44.364

$42.146

$39.928

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Microchip USA

USA . 3,201 parts In-Stock

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$66.320

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$65.160

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$64.590

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$64.010

3,201

$66.320

$65.160

$64.590

$64.010

QUARKTWIN TECHNOLOGY LTD

USA . 3,752 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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Overview

Unleash the power of innovation with the S5LS20206ASPGEQQ1R by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-quality products designed for a wide range of applications. With advanced features such as ADC and DMA channels, this microcontroller offers unparalleled performance and versatility. Whether you're working on automotive projects or IoT applications, this device provides the reliability and efficiency you need. Trust Texas Instruments to provide cutting-edge solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.65 V

Efficient power consumption and suitable for low-power applications.

Address Bus Width: 22

Enables the microcontroller to access a larger memory space efficiently.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality.

Bit Size: 32

High processing power and capabilities for complex operations.

No. of Terminals: 144

Sufficient connections for interfacing with external components and peripherals.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ideal for automotive and industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses reduced instruction set computing architecture for efficient performance.

Speed: 140 rpm

High clock speed for fast execution of instructions and data processing.

Technical Specifications

Microcontrollers S5LS20206ASPGEQQ1R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

0

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

140 rpm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Trade Compliance

S5LS20206ASPGEQQ1R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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