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RM46L850PGET

Texas Instruments

RM46L850PGET by Texas Instruments

Texas Instruments RM46L850PGET microcontroller features 32-bit CPU CORTEX-R4F, 64K Data EEPROM, and 24-Ch 12-Bit ADC. Ideal for industrial applications with CAN, ETHERNET, I2C, SCI, SPI connectivity options and PWM(14), TIMER(41) peripherals. Operating temperature range from -40 to 105 °C with low profile FLATPACK package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,604 parts In-Stock

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Vyrian

USA . 2,530 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 643 parts In-Stock

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$15.665

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643

$15.665

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Parana Technologies

USA . 1,500 parts In-Stock

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$28.684

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$50.517

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$28.684

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$50.517

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DigiPath Technology Company

USA . 1,234 parts In-Stock

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$31.584

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$31.584

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ChromeModa Solutions

Germany . 6,979 parts In-Stock

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$32.229

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$26.428

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6,979

$32.229

$26.428

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IDEA Electronic Components Group

UK . 2,294 parts In-Stock

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$32.229

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$30.618

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$29.006

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2,294

$32.229

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$29.006

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Ampacity Inc.

Singapore . 1,004 parts In-Stock

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$33.000

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$33.000

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One Stop Electronics

USA . 966 parts In-Stock

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$34.000

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Corphita

USA . 3,043 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the RM46L850PGET by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that offer unmatched performance and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages. Experience seamless connectivity, efficient data processing, and innovative features that will elevate your projects to new heights. Choose Texas Instruments for superior quality and unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for electronic components.

Surface Mount: YES

Easy to mount on PCBs, saving space and enabling automated assembly.

Maximum Supply Voltage: 1.32 V

Allows for stable operation within specified voltage range.

Bit Size: 32

High processing capabilities for complex functions and algorithms.

Power Supplies (V): 1.2,3.3

Compatible with common power supply voltages, versatile in design.

No. of Terminals: 144

Sufficient I/O options for connecting to various external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Different packaging options for flexibility in various applications.

Minimum Supply Voltage: 1.14 V

Allows for continued operation even when supply voltage is low.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

CPU Family: CORTEX-R4F

Efficient and reliable processing power for embedded applications.

ADC Channels: YES

Ability to convert analog signals to digital for accurate data processing.

DMA Channels: YES

Enhanced data transfer efficiency without CPU intervention.

ROM Words: 1310720

Large memory capacity for storing program instructions and data.

Maximum Clock Frequency: 80 MHz

High-speed operation for quick response times in applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Specifically designed for microcontroller applications with reduced instruction set computing architecture.

RAM Bytes: 196608

Sufficient random access memory for data storage and retrieval.

Technology: CMOS

Low power consumption and reliable performance in various operating conditions.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Connectivity: CAN(3), ETHERNET, I2C, SCI(2), SPI(4), USB(2)

Versatile connectivity options for communication with different types of devices.

ROM Programmability: FLASH

Flexibility to reprogram memory contents for firmware updates and customization.

No. of I/O Lines: 64

Sufficient input/output lines for interfacing with external peripherals.

Technical Specifications

Microcontrollers RM46L850PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1310720

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(4), USB(2)

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM46L850PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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