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RM46L430PGET

Texas Instruments

RM46L430PGET by Texas Instruments

RM46L430PGET by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family. It features 13-bit address bus, 16-bit external data bus width, and 80 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing and efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,994 parts In-Stock

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7,994

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Digiode

USA . 4,355 parts In-Stock

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4,355

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Distributors (Availability)

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AZTECH Wire

Italy . 663 parts In-Stock

1+ parts

$6.190

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663

$6.190

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One Stop Electronics

USA . 299 parts In-Stock

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$27.000

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$27.000

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Parana Technologies

USA . 1,455 parts In-Stock

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$61.559

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$61.559

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DigiPath Technology Company

USA . 648 parts In-Stock

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$67.784

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648

$67.784

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ChromeModa Solutions

Germany . 4,173 parts In-Stock

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$69.167

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$56.717

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4,173

$69.167

$56.717

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$69.167

100+ parts

$65.709

1k+ parts

$62.250

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732

$69.167

$65.709

$62.250

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Corphita

USA . 3,851 parts In-Stock

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Microchip USA

USA . 138 parts In-Stock

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Overview

Elevate your projects with the RM46L430PGET by Texas Instruments, a top-of-the-line microcontroller that embodies quality and innovation. With its cutting-edge technology and reliable performance, this product is a game-changer in the industry. Whether you're working on automotive applications, industrial automation, or consumer electronics, this versatile microcontroller offers unmatched value, benefits, and advantages to customers looking to take their projects to the next level. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 13

A wider address bus width enables the processor to access a larger memory space.

Bit Size: 32

A 32-bit processor allows for faster processing and handling of larger chunks of data.

Power Supplies (V): 1.2,3.3

The multiple power supply options give flexibility in designing and powering the system.

No. of Terminals: 144

With a large number of terminals, this microcontroller can support a variety of input/output connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles make the microcontroller suitable for compact and space-constrained applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in harsh environments.

CPU Family: CORTEX-R4F

The Cortex-R4F processor family offers high performance and real-time processing capabilities.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can operate in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and conversion.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

The quad terminal position makes it easy to connect external devices and peripherals.

ROM Words: 1048576

The large ROM capacity allows for storing a substantial amount of program and data.

Maximum Seated Height: 1.6 mm

The low seated height makes the microcontroller suitable for compact and slim devices.

Width: 20 mm

The compact width size enables the microcontroller to fit into tight spaces.

External Data Bus Width: 16

A wider external data bus width allows for faster data transfer between the microcontroller and external memory.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables fast processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the microcontroller can be efficiently soldered onto PCBs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability of the connections.

Length: 20 mm

The compact length size contributes to the overall small form factor of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this microcontroller suitable for rugged and demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient and fast execution of instructions.

RAM Bytes: 131072

With a large RAM capacity, the microcontroller can efficiently store and manipulate data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto PCBs for reliable connections.

Maximum Supply Current: 400 mA

The high maximum supply current ensures that the microcontroller has enough power for various functions and peripherals.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

The presence of PWM channels allows for precise control of connected devices such as motors and LEDs.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the program memory of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for densely packed connections on the PCB for space-efficient designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 200 rpm

With a speed of 200 rpm, the microcontroller can execute instructions and process data at a reliable and efficient pace.

No. of I/O Lines: 16

The 16 I/O lines provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers RM46L430PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

RM46L430PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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