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PCI1251AGFNR

Texas Instruments

PCI1251AGFNR by Texas Instruments

PCI1251AGFNR by Texas Instruments is a Bus Controller with 256 terminals in a GRID ARRAY package. Operating temperature ranges from 0 to 70°C, suitable for commercial use. It utilizes CMOS technology and supports power supplies of 3.3V and 3.3/5V, making it ideal for various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,931 parts In-Stock

1+ parts

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6,931

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Digiode

USA . 4,400 parts In-Stock

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4,400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 261 parts In-Stock

1+ parts

$1.000

100+ parts

-

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261

$1.000

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AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$9.269

100+ parts

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561

$9.269

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Parana Technologies

USA . 2,025 parts In-Stock

1+ parts

$56.157

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2,025

$56.157

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Corohmni

South Africa . 3,000 parts In-Stock

1+ parts

$58.773

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3,000

$58.773

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DigiPath Technology Company

USA . 1,798 parts In-Stock

1+ parts

$61.836

100+ parts

$56.889

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1,798

$61.836

$56.889

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$63.098

100+ parts

$59.943

1k+ parts

$56.788

10k+ parts

-

1,278

$63.098

$59.943

$56.788

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ChromeModa Solutions

Germany . 1,010 parts In-Stock

1+ parts

$63.098

100+ parts

$51.740

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1,010

$63.098

$51.740

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Corphita

USA . 2,706 parts In-Stock

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2,706

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Overview

Unlock seamless connectivity and enhanced performance with the PCI1251AGFNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in their products. Designed for Bus Controllers, this innovative solution offers a wide range of applications for various industries. Experience the value and benefits of increased efficiency, improved functionality, and optimized performance with this cutting-edge technology. Upgrade your systems and elevate your operations with the PCI1251AGFNR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Being surface mountable makes the installation of this bus controller easier and more efficient, especially in high-volume production processes.

Power Supplies (V): 3.3, 3.3/5

The ability to operate on multiple power supplies (3.3V and 3.3/5V) offers flexibility in different environments, making this bus controller compatible with various systems.

No. of Terminals: 256

Having 256 terminals allows for a high level of connectivity and compatibility with different devices and systems, making this bus controller versatile in application.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this bus controller can function reliably in a wide range of operating conditions, enhancing its usability.

Technology: CMOS

The CMOS technology used in this bus controller offers low power consumption, high noise immunity, and compatibility with various digital systems, making it a reliable choice for bus communication.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides a good balance between space efficiency and ease of soldering, making this bus controller user-friendly for assembly and maintenance.

Technical Specifications

Bus Controllers PCI1251AGFNR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B256

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

PCI1251AGFNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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