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PCI1131

Texas Instruments

PCI1131 by Texas Instruments

PCI1131 by Texas Instruments is a bus controller with 32-bit address and external data bus width. Operating at 33.33 MHz, it supports PCMCIA bus compatibility and CMOS technology. With a package style of flatpack, low profile, fine pitch, it is ideal for commercial applications requiring a max supply voltage of 3.6 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,793 parts In-Stock

1+ parts

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7,793

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Digiode

USA . 3,177 parts In-Stock

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3,177

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 379 parts In-Stock

1+ parts

$16.000

100+ parts

-

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379

$16.000

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$16.111

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322

$16.111

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Parana Technologies

USA . 724 parts In-Stock

1+ parts

$31.979

100+ parts

-

1k+ parts

$93.655

10k+ parts

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724

$31.979

-

$93.655

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ChromeModa Solutions

Germany . 5,342 parts In-Stock

1+ parts

$35.932

100+ parts

$29.464

1k+ parts

-

10k+ parts

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5,342

$35.932

$29.464

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IDEA Electronic Components Group

UK . 346 parts In-Stock

1+ parts

$35.932

100+ parts

$34.135

1k+ parts

$32.339

10k+ parts

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346

$35.932

$34.135

$32.339

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$45.495

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478

$45.495

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Corphita

USA . 3,611 parts In-Stock

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3,611

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DigiPath Technology Company

USA . 2,253 parts In-Stock

1+ parts

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100+ parts

$32.396

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2,253

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$32.396

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Overview

Experience top-tier quality and unmatched reliability with the Texas Instruments PCI1131 Bus Controller. As a leading manufacturer in the industry, Texas Instruments delivers innovative solutions for your applications. The PCI1131 offers seamless integration and high performance, making it the ideal choice for your projects. Unlock the value and benefits of this product today and take your designs to the next level. Choose Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for use in various environments.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V provides flexibility and compatibility with different power sources.

Address Bus Width: 32

With a wide address bus width of 32 bits, this bus controller can handle large amounts of data efficiently.

No. of Terminals: 208

Having a large number of terminals allows for connectivity to a wide range of other components and peripherals.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding temperature conditions.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high reliability in operation.

Maximum Clock Frequency: 33.33 MHz

With a high maximum clock frequency of 33.33MHz, this bus controller can process data quickly and efficiently.

Technical Specifications

Bus Controllers PCI1131 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCMCIA

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

PCI1131 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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