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PCI1225GHK

Texas Instruments

PCI1225GHK by Texas Instruments

PCI1225GHK by Texas Instruments is a Bus Controller with 32-bit Address and External Data Bus Width. It operates at 3.3V, supports PCI bus compatibility, and has a max clock frequency of 33.33 MHz. Ideal for PCMCIA applications due to its low profile package style and high data transfer rate of 130 MBps.

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Lifecycle Status

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Vyrian

USA . 7,038 parts In-Stock

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Digiode

USA . 2,235 parts In-Stock

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Legend Electronics Inc.

USA . 2,060 parts In-Stock

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Greenchips

USA . 151 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 151 parts In-Stock

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J & M Industries LLC

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Inventory MP

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Bristol Electronics

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AZTECH Wire

Italy . 562 parts In-Stock

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$6.379

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One Stop Electronics

USA . 487 parts In-Stock

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$25.000

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Corohmni

South Africa . 2,380 parts In-Stock

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$31.213

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Parana Technologies

USA . 951 parts In-Stock

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DigiPath Technology Company

USA . 1,411 parts In-Stock

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ChromeModa Solutions

Germany . 3,553 parts In-Stock

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IDEA Electronic Components Group

UK . 495 parts In-Stock

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$79.886

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$75.682

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A-Z Elektronik GmbH

Germany . 5,589 parts In-Stock

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Corphita

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GreenTree Electronics

Israel . 655 parts In-Stock

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Kepictronics

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Overview

Unlock seamless data transfer and enhanced performance with the Texas Instruments PCI1225GHK bus controller. Manufactured by industry leader Texas Instruments, this high-quality product offers a reliable solution for your PCMCIA applications. With a maximum data transfer rate of 130 MBps and a maximum clock frequency of 33.33 MHz, this innovative device is designed to meet your connectivity needs. Experience the value and benefits of this cutting-edge technology, providing you with faster speeds and improved efficiency for all your computing tasks. Elevate your system with the Texas Instruments PCI1225GHK today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the bus controller.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with a wide range of power sources for versatile usage.

Address Bus Width: 32

Ability to handle large volumes of data for efficient communication within the system.

No. of Terminals: 209

Offers ample connection points for various peripherals and components to be linked to the bus controller.

Maximum Data Transfer Rate: 130 MBps

High-speed data transfer capability ensures smooth and quick communication between devices.

Maximum Clock Frequency: 33.33 MHz

Efficiently processes data at a fast rate, enhancing overall system performance.

Bus Compatibility: PCI

Compatible with PCI bus systems, allowing for seamless integration into existing setups.

Technical Specifications

Bus Controllers PCI1225GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33.33 MHz

Maximum Data Transfer Rate:

130 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B209

Length:

16 mm

No. of Terminals:

209

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA209,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI1225GHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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