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PCI1221PDV

Texas Instruments

PCI1221PDV by Texas Instruments

PCI1221PDV by Texas Instruments is a Bus Controller with 32-bit Address Bus Width and 130 MBps Data Transfer Rate. It operates at 3-3.6 V, has 208 terminals, and supports PCI bus compatibility. Ideal for PCMCIA applications due to its low profile design and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,436 parts In-Stock

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2,436

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Digiode

USA . 824 parts In-Stock

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824

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PC Components Company LLC

USA . 480 parts In-Stock

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480

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Pegasus Components GmbH

Germany . 405 parts In-Stock

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Bristol Electronics

USA . 360 parts In-Stock

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Prism Electronics

USA . 248 parts In-Stock

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248

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Semi Source

USA . 40 parts In-Stock

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Zilex Electronics Inc.

Canada . 21 parts In-Stock

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One Stop Electronics

USA . 242 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 447 parts In-Stock

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$14.388

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$57.925

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$57.346

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$55.029

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100

$57.925

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$55.029

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Parana Technologies

USA . 864 parts In-Stock

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$59.496

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DigiPath Technology Company

USA . 1,216 parts In-Stock

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$65.513

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ChromeModa Solutions

Germany . 4,289 parts In-Stock

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$66.850

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$54.817

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IDEA Electronic Components Group

UK . 874 parts In-Stock

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$66.850

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$63.508

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$60.165

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Corohmni

South Africa . 168 parts In-Stock

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$82.674

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,885 parts In-Stock

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Metaverse IC Inc.

Canada . 671 parts In-Stock

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GreenTree Electronics

Israel . 170 parts In-Stock

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Assy Fe

Spain . 7 parts In-Stock

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Overview

Discover the cutting-edge PCI1221PDV by Texas Instruments, a top-tier Bus Controller designed to elevate your electronic projects. With Texas Instruments' renowned quality and reliability, this product offers seamless integration and exceptional performance. Ideal for a wide range of applications, the PCI1221PDV ensures fast data transfer rates and efficient power management. Experience the value and advantages of this innovative product, making your projects stand out with ease and precision. Elevate your creations with the PCI1221PDV today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during transportation or installation.

Surface Mount: YES

Allows for easy and secure mounting onto circuit boards, saving space and improving overall design aesthetics.

Maximum Supply Voltage: 3.6 V

Provides a high enough voltage for efficient operation without risking damage to the components.

Address Bus Width: 32

A wide address bus width allows for efficient and fast communication between devices, improving overall system performance.

Package Shape: SQUARE

Square shape makes it easy to place and secure within a circuit board layout, optimizing space usage.

Power Supplies (V): 3.3,3.3/5

Offers flexibility in power supply options, allowing for compatibility with different systems and configurations.

No. of Terminals: 208

A high number of terminals provide ample connectivity options, allowing for versatile integration into various setups.

Minimum Supply Voltage: 3 V

Ensures reliable operation even with lower voltage input, making it suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures without performance degradation, ensuring stable operation in demanding environments.

Maximum Data Transfer Rate: 130 MBps

High data transfer rate enables quick and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

Capable of functioning in low temperature conditions, making it suitable for use in various environments.

Terminal Position: QUAD

Quad terminal position offers stability and ease of connection, enhancing reliability in data transmission.

Maximum Seated Height: 1.6 mm

Low seated height profile minimizes the overall size of the product, ideal for compact and space-constrained applications.

Width: 28 mm

Compact width size allows for easy integration into different system designs, optimizing space usage.

External Data Bus Width: 32

Wide external data bus width ensures high-speed data transfer, improving overall system efficiency.

Maximum Clock Frequency: 33.33 MHz

High clock frequency enables fast and synchronized data processing, enhancing system performance.

Length: 28 mm

Compact length size facilitates easy installation and placement in various system setups.

Temperature Grade: COMMERCIAL

Suitable for use in standard commercial environments, ensuring stable performance in typical operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Specifically designed as a bus controller for PCMCIA devices, providing seamless compatibility and integration.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall product reliability and efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, minimizing the risk of signal disruption or loss.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation in various system configurations.

Bus Compatibility: PCI

PCI bus compatibility allows for seamless integration with a wide range of computer systems and devices, enhancing flexibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and minimizes signal interference, ensuring stable data transmission.

Technical Specifications

Bus Controllers PCI1221PDV attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33.33 MHz

Maximum Data Transfer Rate:

130 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Trade Compliance

PCI1221PDV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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