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PCI1251BGFN

Texas Instruments

PCI1251BGFN by Texas Instruments

PCI1251BGFN by Texas Instruments is a Bus Controller with 32-bit Address Bus Width, 130 MBps Data Transfer Rate, and 33 MHz Clock Frequency. It is used in PCMCIA applications for PCI and ISA bus compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,492 parts In-Stock

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Digiode

USA . 1,300 parts In-Stock

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Sea View Technologies

USA . 1,132 parts In-Stock

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Bristol Electronics

USA . 1,132 parts In-Stock

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Dan-Mar Components

USA . 50 parts In-Stock

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50

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Prism Electronics

USA . 49 parts In-Stock

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49

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AZTECH Wire

Italy . 462 parts In-Stock

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$12.850

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$12.850

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Parana Technologies

USA . 1,152 parts In-Stock

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$13.937

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$14.414

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DigiPath Technology Company

USA . 2,273 parts In-Stock

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$15.347

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$14.119

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ChromeModa Solutions

Germany . 3,826 parts In-Stock

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$15.660

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$12.841

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IDEA Electronic Components Group

UK . 1,240 parts In-Stock

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$15.660

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$14.877

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$14.094

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One Stop Electronics

USA . 1,576 parts In-Stock

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$22.000

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Corohmni

South Africa . 3,114 parts In-Stock

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Lixinc

USA . 18,057 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,085 parts In-Stock

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Corphita

USA . 292 parts In-Stock

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Perfect Parts

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Overview

Enhance your system's performance with the Texas Instruments PCI1251BGFN bus controller. Crafted with superior quality materials and cutting-edge technology, this product offers seamless data transfer at a blazing speed of up to 130 MBps. Perfect for various applications in the PCMCIA realm, this device ensures reliability and efficiency. Experience the value of smoother operations and enhanced productivity with the PCI1251BGFN, a top-tier solution from a trusted manufacturer like Texas Instruments. Elevate your system's capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of systems.

Address Bus Width: 32

A wider address bus width allows for increased data processing capabilities.

Package Shape: SQUARE

The square package shape provides efficient use of space on the PCB.

Power Supplies (V): 3.3,3.3/5

Offers flexibility in power supply options for different system requirements.

No. of Terminals: 256

A high number of terminals allow for connectivity with multiple components.

Package Style (Meter): GRID ARRAY

Grid array package style offers good thermal performance and electrical connection reliability.

Minimum Supply Voltage: 3 V

The minimum supply voltage ensures stable operation under varying conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliability in different environmental conditions.

Maximum Data Transfer Rate: 130 MBps

High data transfer rate allows for efficient communication between devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality in cold environments.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for board assembly and connection.

Maximum Seated Height: 2.32 mm

Low seated height saves space and allows for compact designs.

Width: 27 mm

The moderate width allows for fitting in various board layouts.

External Data Bus Width: 32

Matching external data bus width with address bus width ensures efficient data transfer.

Maximum Clock Frequency: 33 MHz

High clock frequency allows for quick data processing and response times.

Length: 27 mm

The moderate length makes it suitable for various board sizes.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

The bus controller and PCMCIA peripheral IC type make it suitable for interfacing with various bus systems and devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form allows for reliable electrical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and efficient performance.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA bus systems allows for flexibility in system integration.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on the PCB.

Technical Specifications

Bus Controllers PCI1251BGFN attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

32

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

130 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.32 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

PCI1251BGFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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