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PCI1250AGFN

Texas Instruments

PCI1250AGFN by Texas Instruments

PCI1250AGFN by Texas Instruments is a Bus Controller with 32-bit Address Bus Width, 130 MBps Data Transfer Rate, and 33 MHz Clock Frequency. It is used in PCMCIA applications for PCI bus compatibility, featuring a max supply voltage of 3.6 V and operating temperature range of 0-70°C.

Median Price

$14.300

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,156 parts In-Stock

1+ parts

-

100+ parts

$11.440

1k+ parts

$10.230

10k+ parts

$9.630

7,156

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$11.440

$10.230

$9.630

DigiKey

USA . 7,156 parts In-Stock

1+ parts

-

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$15.050

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7,156

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$15.050

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Verical

USA . 7,156 parts In-Stock

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$14.300

1k+ parts

$12.787

10k+ parts

$12.037

7,156

-

$14.300

$12.787

$12.037

Distributors (In-Stock)

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Digiode

USA . 591 parts In-Stock

1+ parts

$12.074

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591

$12.074

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Vyrian

USA . 2,722 parts In-Stock

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$12.710

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2,722

$12.710

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American Microsemiconductor Inc.

USA . 20 parts In-Stock

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$34.760

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20

$34.760

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R&J Components

USA . 550 parts In-Stock

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550

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Electronics Depot

USA . 321 parts In-Stock

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A2Z Electronics, Inc.

USA . 200 parts In-Stock

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200

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 148 parts In-Stock

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148

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Bristol Electronics

USA . 128 parts In-Stock

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128

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Connector Distribution Corp

USA . 105 parts In-Stock

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105

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Right Parts Inc.

USA . 105 parts In-Stock

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105

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Cyclops Electronics Ltd

UK . 21 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 2,867 parts In-Stock

1+ parts

$11.330

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2,867

$11.330

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Corphita

USA . 4,015 parts In-Stock

1+ parts

$11.439

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4,015

$11.439

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Component Stockers USA

USA . 10,076 parts In-Stock

1+ parts

$13.040

100+ parts

$12.260

1k+ parts

$11.090

10k+ parts

-

10,076

$13.040

$12.260

$11.090

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Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

$42.198

100+ parts

$3,918.684

1k+ parts

$37.978

10k+ parts

-

1,512

$42.198

$3,918.684

$37.978

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DigiPath Technology Company

USA . 1,372 parts In-Stock

1+ parts

$46.465

100+ parts

$42.748

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1,372

$46.465

$42.748

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ChromeModa Solutions

Germany . 6,008 parts In-Stock

1+ parts

$47.413

100+ parts

$38.879

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6,008

$47.413

$38.879

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IDEA Electronic Components Group

UK . 97 parts In-Stock

1+ parts

$47.413

100+ parts

$45.042

1k+ parts

$42.672

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97

$47.413

$45.042

$42.672

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A-Z Elektronik GmbH

Germany . 6,938 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 958 parts In-Stock

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Perfect Parts

USA . 186 parts In-Stock

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ChipTracer

USA . 128 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 19 parts In-Stock

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19

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Overview

Experience seamless data transfer and reliable performance with the PCI1250AGFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and cutting-edge technology in the form of bus controllers like this one. Ideal for a variety of applications, this product offers customers unparalleled value and benefits. Trust in Texas Instruments to provide you with the best solutions for your data transfer needs. Elevate your systems with the PCI1250AGFN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy ensures durability and lightweight design for easy handling and installation.

Surface Mount: YES

Surface mount design allows for easy and secure mounting on a PCB, saving space and providing a clean appearance.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources and reduces the risk of damage from overvoltage.

Address Bus Width: 32

With a 32-bit address bus width, this bus controller can handle large amounts of data efficiently and support high-speed data transfers.

Package Shape: SQUARE

The square package shape allows for easy integration into a PCB layout and efficient use of space.

Power Supplies (V): 3.3,3.3/5

Multiple voltage options provide flexibility in power supply configuration to meet the needs of different system requirements.

No. of Terminals: 256

Having 256 terminals allows for a high level of connectivity and compatibility with various components in a system.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout of terminals, making it easier for assembly and ensuring reliable connections.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures stable operation of the bus controller even under low power conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this bus controller can withstand harsh environmental conditions and maintain performance reliability.

Maximum Data Transfer Rate: 130 MBps

The high data transfer rate of 130 MBps enables quick and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable functionality even in cold environments, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easy and secure connection to the PCB, ensuring stable and reliable signal transmission.

Maximum Seated Height: 2.32 mm

The low maximum seated height of 2.32mm helps in reducing PCB profile and overall system height, making it suitable for space-constrained applications.

Width: 27 mm

The compact width of 27mm allows for easy integration into the PCB layout without taking up too much space.

External Data Bus Width: 32

Having a 32-bit external data bus width allows for efficient data transfer between the bus controller and external devices, enabling high-speed communication.

Maximum Clock Frequency: 33 MHz

The maximum clock frequency of 33 MHz ensures high-speed processing and data transfer, enhancing overall system performance.

Length: 27 mm

With a length of 27mm, this bus controller offers a compact form factor, making it suitable for space-limited applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade ensures compatibility with standard operating environments and reliability in everyday use.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

The peripheral IC type of bus controller, PCMCIA, allows for seamless integration with PCMCIA-compatible devices, expanding the range of applications.

Technology: CMOS

Utilizing CMOS technology enables low power consumption, high-speed operation, and compatibility with a wide range of devices and systems.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection on the PCB, ensuring stable signal transmission and minimizing the risk of disconnection.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures consistent and stable power supply for reliable performance in various applications.

Bus Compatibility: PCI

Being compatible with PCI bus architecture allows for easy integration into existing system designs and compatibility with a wide range of devices.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for easy and precise soldering of terminals on the PCB, ensuring a secure and reliable connection.

Technical Specifications

Bus Controllers PCI1250AGFN attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

130 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.32 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

PCI1250AGFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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