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ONET4291TAYS

Texas Instruments

ONET4291TAYS by Texas Instruments

ONET4291TAYS by Texas Instruments is a telecom IC with 10 terminals, operating at 3.3V. It features a max supply current of 0.025mA and temperature range from -40 to 85°C. Ideal for industrial applications requiring telecom circuit interfaces in a surface-mount rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,305 parts In-Stock

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Digiode

USA . 996 parts In-Stock

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996

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Distributors (Availability)

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AZTECH Wire

Italy . 611 parts In-Stock

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$8.984

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611

$8.984

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Parana Technologies

USA . 2,014 parts In-Stock

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$9.268

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$9.901

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$9.268

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$9.901

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ChromeModa Solutions

Germany . 5,508 parts In-Stock

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$10.414

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$8.539

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$10.414

$8.539

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IDEA Electronic Components Group

UK . 1,838 parts In-Stock

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$10.414

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$9.893

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$9.373

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$9.373

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Component Stockers USA

USA . 774 parts In-Stock

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$99.990

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774

$99.990

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One Stop Electronics

USA . 1,283 parts In-Stock

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$636.000

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$636.000

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Semicontronic

India . 726 parts In-Stock

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$744.000

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$725.400

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$721.680

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726

$744.000

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$721.680

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Ampacity Inc.

Singapore . 366 parts In-Stock

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$933.000

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$933.000

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DigiPath Technology Company

USA . 1,899 parts In-Stock

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$9.389

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Corohmni

South Africa . 489 parts In-Stock

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Corphita

USA . 334 parts In-Stock

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Microchip USA

USA . 125 parts In-Stock

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Overview

Enhance your telecom interface systems with the ONET4291TAYS by Texas Instruments. This high-quality IC offers superior performance and reliability, making it the go-to choice for a wide range of applications. Whether you're in telecommunications, industrial control, or beyond, this product delivers exceptional value and benefits to customers. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular packaging is typically more space-efficient and easier to handle during the assembly process.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with a wide range of electronic devices.

No. of Terminals: 10

Having 10 terminals provides flexibility for connecting to various components within a telecom system.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40°C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments.

Terminal Position: UPPER

The terminal position being upper makes it easier to access and connect to other components in the system.

Temperature Grade: INDUSTRIAL

Being industrial grade means that this product is designed to meet the robust requirements of industrial applications.

Terminal Form: NO LEAD

Having a no lead terminal form can improve reliability and reduce the risk of solder joint failures.

Maximum Supply Current: 0.025 mA

With a low maximum supply current of 0.025 mA, this product is energy-efficient and minimizes power consumption.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit IC ensures optimal performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures stable and reliable performance in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ONET4291TAYS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XUUC-N10

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.025 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ONET4291TAYS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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