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ONET8501TYS

Texas Instruments

ONET8501TYS by Texas Instruments

ONET8501TYS by Texas Instruments is a telecom IC with 11300 Mbps data rate, operating at -40 to 100°C. It has 19 terminals, surface mountable in an unencased chip package style. Ideal for industrial applications requiring a 3.3V supply and up to 44 mA current consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,672 parts In-Stock

1+ parts

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4,672

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Digiode

USA . 2,375 parts In-Stock

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2,375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,826 parts In-Stock

1+ parts

$8.004

100+ parts

-

1k+ parts

$8.582

10k+ parts

-

1,826

$8.004

-

$8.582

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DigiPath Technology Company

USA . 1,600 parts In-Stock

1+ parts

$8.813

100+ parts

-

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1,600

$8.813

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ChromeModa Solutions

Germany . 3,706 parts In-Stock

1+ parts

$8.993

100+ parts

$7.374

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-

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3,706

$8.993

$7.374

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IDEA Electronic Components Group

UK . 342 parts In-Stock

1+ parts

$8.993

100+ parts

$8.543

1k+ parts

$8.094

10k+ parts

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342

$8.993

$8.543

$8.094

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AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$15.522

100+ parts

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637

$15.522

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Microchip USA

USA . 109 parts In-Stock

1+ parts

$24.780

100+ parts

$24.630

1k+ parts

$24.560

10k+ parts

$24.480

109

$24.780

$24.630

$24.560

$24.480

Component Stockers USA

USA . 205 parts In-Stock

1+ parts

$99.990

100+ parts

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205

$99.990

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One Stop Electronics

USA . 660 parts In-Stock

1+ parts

$684.000

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660

$684.000

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Corphita

USA . 4,563 parts In-Stock

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4,563

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Perfect Parts

USA . 616 parts In-Stock

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616

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Overview

Elevate your telecom interface experience with the ONET8501TYS by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers once again with this cutting-edge product. Designed for a wide range of applications in the telecom industry, this sleek and compact IC offers unparalleled value and benefits to customers. Say goodbye to slow data rates and hello to lightning-fast performance with the ONET8501TYS. Upgrade your tech game today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making this product suitable for high-density applications.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space, making it ideal for space-constrained environments.

No. of Terminals: 19

Having 19 terminals allows for versatile connectivity options and functionality in various telecom interface applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in diverse environments, from cold storage facilities to outdoor installations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand wide temperature variations commonly found in industrial settings, enhancing its durability and reliability.

Maximum Supply Current: 44 mA

Low maximum supply current consumption helps in reducing power consumption and heat dissipation, resulting in energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V allows compatibility with common power sources, making integration easier and more cost-effective.

Data Rate: 11300 Mbps

The high data rate support enables fast and efficient data transmission, making this product suitable for high-speed telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ONET8501TYS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

Data rate is 11.3 Gbps

Data Rate:

11300 Mbps

JESD-30 Code:

R-XUUC-N19

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Current:

44 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ONET8501TYS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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