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ONET8501PRGTR

Texas Instruments

ONET8501PRGTR by Texas Instruments

ONET8501PRGTR by Texas Instruments is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 100°C, suitable for industrial use. It supports a data rate of 11300 Mbps and operates at a nominal voltage of 3.3V, making it ideal for high-speed telecom applications.

Median Price

$2.046

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,881 parts In-Stock

1+ parts

$2.707

100+ parts

$2.372

1k+ parts

$1.340

10k+ parts

-

27,881

$2.707

$2.372

$1.340

-

DigiKey

USA . 40,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.830

10k+ parts

-

40,985

-

-

$1.830

-

Rochester

USA . 31,750 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

$1.730

10k+ parts

$1.620

31,750

-

$1.930

$1.730

$1.620

Verical

USA . 16,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.163

10k+ parts

$2.025

16,750

-

-

$2.163

$2.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,852 parts In-Stock

1+ parts

$1.767

100+ parts

-

1k+ parts

-

10k+ parts

-

4,852

$1.767

-

-

-

Vyrian

USA . 4,609 parts In-Stock

1+ parts

$1.860

100+ parts

-

1k+ parts

-

10k+ parts

-

4,609

$1.860

-

-

-

DigiKey Marketplace

USA . 40,985 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

-

10k+ parts

-

40,985

-

$1.930

-

-

Component Sense

UK . 2,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,921

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,700

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 78 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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78

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 367 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$1.674

-

-

-

Parana Technologies

USA . 1,647 parts In-Stock

1+ parts

$5.705

100+ parts

-

1k+ parts

$6.499

10k+ parts

-

1,647

$5.705

-

$6.499

-

DigiPath Technology Company

USA . 1,671 parts In-Stock

1+ parts

$6.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,671

$6.282

-

-

-

IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$6.410

100+ parts

-

1k+ parts

$5.769

10k+ parts

-

2,329

$6.410

-

$5.769

-

ChromeModa Solutions

Germany . 796 parts In-Stock

1+ parts

$6.410

100+ parts

$5.256

1k+ parts

-

10k+ parts

-

796

$6.410

$5.256

-

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,000

-

-

-

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Lixinc

USA . 10,901 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,901

-

-

-

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A-Z Elektronik GmbH

Germany . 6,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,906

-

-

-

-

Overview

Discover the ONET8501PRGTR by Texas Instruments, a high-quality telecom interface IC that offers unmatched performance and reliability. Manufactured by a trusted industry leader, this product is perfect for a wide range of applications in the telecommunications sector. With its advanced features and innovative design, customers can expect seamless integration, improved efficiency, and enhanced functionality. Experience the value and benefits this product brings to your projects, making it a must-have for any telecom application. Trust Texas Instruments for superior quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection for the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

The square package shape allows for compact and space-saving design, making it suitable for applications with limited board space.

No. of Terminals: 16

With 16 terminals, this IC provides multiple connection points, enabling versatile connectivity options in telecom interfaces.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures stable performance even under demanding conditions, making it suitable for industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish enhances conductivity and corrosion resistance, ensuring reliable signal transmission.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in telecom applications, providing compatibility and ease of integration.

Data Rate: 11300 Mbps

The high data rate of 11300 Mbps allows for fast and efficient data transmission, especially in high-speed telecom networks.

Technical Specifications

Other Function Telecom Interface ICs ONET8501PRGTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

11300 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ONET8501PRGTR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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