Loading...

ONET8501PRGTT

Texas Instruments

ONET8501PRGTT by Texas Instruments

ONET8501PRGTT by Texas Instruments is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 100°C, data rate of 11300 Mbps, and nominal voltage of 3.3V make it ideal for industrial telecom circuit applications.

Median Price

$2.214

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,880 parts In-Stock

1+ parts

$2.959

100+ parts

$2.412

1k+ parts

$1.608

10k+ parts

-

7,880

$2.959

$2.412

$1.608

-

Rochester

USA . 44,588 parts In-Stock

1+ parts

-

100+ parts

$2.010

1k+ parts

$1.800

10k+ parts

$1.700

44,588

-

$2.010

$1.800

$1.700

DigiKey

USA . 44,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.190

10k+ parts

-

44,588

-

-

$2.190

-

Verical

USA . 32,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.237

10k+ parts

$2.112

32,395

-

-

$2.237

$2.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.990

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.990

-

-

-

Digiode

USA . 1,889 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

$2.118

-

-

-

DigiKey Marketplace

USA . 44,645 parts In-Stock

1+ parts

-

100+ parts

$2.320

1k+ parts

-

10k+ parts

-

44,645

-

$2.320

-

-

Vyrian

USA . 24,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,909

-

-

-

-

Pegasus Components GmbH

Germany . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 32,355 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

32,355

$1.900

-

-

-

Corphita

USA . 3,738 parts In-Stock

1+ parts

$2.007

100+ parts

-

1k+ parts

-

10k+ parts

-

3,738

$2.007

-

-

-

Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

$7.053

100+ parts

-

1k+ parts

$7.592

10k+ parts

-

1,302

$7.053

-

$7.592

-

ChromeModa Solutions

Germany . 2,061 parts In-Stock

1+ parts

$7.925

100+ parts

$6.498

1k+ parts

-

10k+ parts

-

2,061

$7.925

$6.498

-

-

IDEA Electronic Components Group

UK . 1,712 parts In-Stock

1+ parts

$7.925

100+ parts

-

1k+ parts

$7.132

10k+ parts

-

1,712

$7.925

-

$7.132

-

Lixinc

USA . 17,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,153

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,160

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

$7.145

1k+ parts

-

10k+ parts

-

1,045

-

$7.145

-

-

Perfect Parts

USA . 616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

616

-

-

-

-

Overview

Enhance your telecom systems with the Texas Instruments ONET8501PRGTT, a high-quality Other Function Telecom Interface IC that promises reliability and efficiency. Texas Instruments is known for its cutting-edge technology and innovative solutions, ensuring top-notch performance in every product they create. This versatile chip carrier package boasts a very thin profile and is designed for surface mounting, making it perfect for a wide range of applications. Upgrade your telecommunications equipment with the ONET8501PRGTT and experience enhanced data transmission speeds and seamless connectivity, all while enjoying the superior value and benefits that Texas Instruments products offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

No. of Terminals: 16

Provides sufficient connectivity options for various telecommunications interfaces.

Maximum Operating Temperature: 100 °C

Ensures stable performance even in high-temperature environments, making it suitable for industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of Ni/Pd/Au finish on terminals enhances conductivity and corrosion resistance, ensuring reliable connections.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level, making it compatible with most power sources.

Data Rate: 11300 Mbps

High data rate capability allows for fast and efficient data transmission, making it suitable for demanding telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ONET8501PRGTT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

11300 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ONET8501PRGTT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19