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MM74HC157N/A+

Texas Instruments

MM74HC157N/A+ by Texas Instruments

MM74HC157N/A+ by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 2-6V, with a propagation delay of 32ns at nominal supply. This IC is ideal for applications requiring high-speed signal switching in temperature ranges from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,784 parts In-Stock

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Digiode

USA . 4,097 parts In-Stock

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Anansix

USA . 2,690 parts In-Stock

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AZTECH Wire

Italy . 466 parts In-Stock

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$19.546

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Parana Technologies

USA . 1,015 parts In-Stock

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$24.065

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$24.717

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ChromeModa Solutions

Germany . 4,217 parts In-Stock

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$27.039

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$22.172

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$27.039

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

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$27.039

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$25.687

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$24.335

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$24.335

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One Stop Electronics

USA . 1,190 parts In-Stock

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$37.000

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Corphita

USA . 4,359 parts In-Stock

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DigiPath Technology Company

USA . 874 parts In-Stock

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$24.378

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Overview

Enhance your electronic projects with the MM74HC157N/A+ by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the Multiplexer & Demultiplexer category. This versatile component offers 4 functions, 2 inputs, and a propagation delay of just 32 ns, making it ideal for a wide range of applications. With a nominal supply voltage of 5V and a compact design, this product provides value, efficiency, and ease of use for customers looking to streamline their circuit designs. Upgrade your projects today with the MM74HC157N/A+!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the product, making it suitable for various environments.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures fast data processing and response time, making the product efficient in data transmission.

No. of Functions: 4

Having 4 functions allows for versatile signal routing and processing capabilities, making the product suitable for complex applications.

No. of Inputs: 2

Having 2 inputs provides flexibility in signal routing and processing options, making the product adaptable to different input configurations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, the product can handle connected loads efficiently, ensuring signal integrity and reliability.

No. of Terminals: 16

Having 16 terminals provides ample connection options for input and output signals, allowing for versatile configuration possibilities.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Multiplexer & Demultiplexer MM74HC157N/A+ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

158 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MM74HC157N/A+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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