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MM74HC153J/A+

Texas Instruments

MM74HC153J/A+ by Texas Instruments

MM74HC153J/A+ by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 4 inputs, and operates b/w -40 to 85°C. It has 16 terminals in an inline package style suitable for industrial applications requiring ceramic package body material and tin/lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,010 parts In-Stock

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8,010

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Digiode

USA . 4,105 parts In-Stock

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4,105

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Anansix

USA . 913 parts In-Stock

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913

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 321 parts In-Stock

1+ parts

$11.337

100+ parts

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1k+ parts

$11.766

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321

$11.337

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$11.766

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DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$12.483

100+ parts

$11.485

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340

$12.483

$11.485

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ChromeModa Solutions

Germany . 5,863 parts In-Stock

1+ parts

$12.738

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$10.445

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5,863

$12.738

$10.445

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

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$12.738

100+ parts

$12.101

1k+ parts

$11.464

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2,322

$12.738

$12.101

$11.464

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One Stop Electronics

USA . 1,226 parts In-Stock

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$14.000

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1,226

$14.000

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AZTECH Wire

Italy . 460 parts In-Stock

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$16.293

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460

$16.293

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Corphita

USA . 4,487 parts In-Stock

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4,487

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Overview

Unlock a world of possibilities with the Texas Instruments MM74HC153J/A+ multiplexer and demultiplexer. Manufactured with precision and quality in mind, this versatile component offers unparalleled performance in a wide range of applications. With its dual functions, four inputs, and industrial-grade technology, this product provides customers with reliability and efficiency like never before. Trust Texas Instruments to deliver value, benefits, and advantages that exceed expectations every time. Elevate your projects with the MM74HC153J/A+ and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal and mechanical properties, enhancing the durability and reliability of the multiplexer & demultiplexer.

No. of Functions: 2

Having multiple functions allows for efficient data routing and management, making this product versatile and capable of handling various tasks simultaneously.

No. of Inputs: 4

The 4 inputs offer flexibility and expanded connectivity options, enabling the multiplexer & demultiplexer to accommodate a wider range of input sources.

Package Shape: RECTANGULAR

Rectangular package shape aids in easy integration with other components and circuit boards, optimizing space utilization and overall design efficiency.

Power Supplies (V): 2/6

Support for two different power supply voltages (2V and 6V) provides versatility in operation, catering to varying electrical requirements and ensuring compatibility in different setups.

No. of Terminals: 16

With 16 terminals, this multiplexer & demultiplexer offers extensive connection options, enhancing connectivity and facilitating seamless integration with external devices.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance, offering convenience in setup and cabling arrangements for efficient use in diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environments and industrial settings with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold conditions, making this product suitable for a wide range of temperature environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish enhances solderability and solder joint reliability, ensuring secure connections and stable performance of the multiplexer & demultiplexer.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board mounting options, offering multiple installation choices to suit various layout requirements and preferences.

Temperature Grade: INDUSTRIAL

Industrial temperature-grade designation signifies robustness and durability, indicating that this multiplexer & demultiplexer is designed to withstand harsh industrial conditions and demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and efficient signal processing, making this product energy-efficient and reliable in data transmission and management.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies soldering and assembly processes, providing mechanical strength and secure connections for reliable performance of the multiplexer & demultiplexer.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard connectors and layout spacing, facilitating easy integration and connection with other components in electronic circuits.

Technical Specifications

Multiplexer & Demultiplexer MM74HC153J/A+ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MM74HC153J/A+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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