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MM74HC151J/A+

Texas Instruments

MM74HC151J/A+ by Texas Instruments

MM74HC151J/A+ by Texas Instruments is an 8-input multiplexer with a supply voltage range of 2V to 6V. It features a propagation delay of 244ns, operating temperature from -40°C to 85°C, and CMOS technology. This IC is ideal for industrial applications requiring high-speed signal switching in a compact IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,310 parts In-Stock

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Digiode

USA . 2,383 parts In-Stock

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Anansix

USA . 1,078 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 993 parts In-Stock

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$9.070

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$9.730

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993

$9.070

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DigiPath Technology Company

USA . 386 parts In-Stock

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$9.987

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$9.188

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386

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$9.188

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ChromeModa Solutions

Germany . 1,105 parts In-Stock

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$10.191

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$8.357

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$10.191

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IDEA Electronic Components Group

UK . 71 parts In-Stock

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$10.191

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$9.681

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$9.172

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71

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$9.172

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AZTECH Wire

Italy . 803 parts In-Stock

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$12.558

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One Stop Electronics

USA . 696 parts In-Stock

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$35.000

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Corphita

USA . 3,632 parts In-Stock

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Overview

Upgrade your electronic projects with the MM74HC151J/A+ by Texas Instruments. Crafted with precision using high-quality materials, this multiplexer & demultiplexer offers unmatched performance and reliability. Perfect for a wide range of applications, this product provides seamless signal routing while ensuring optimal efficiency. Trust in the expertise of Texas Instruments to deliver cutting-edge technology that meets your needs. Experience the value and benefits this versatile component brings to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and protection for the internal components of the multiplexer/demultiplexer, ensuring reliable performance in various environments.

No. of Inputs: 8

Allows for the multiplexing or demultiplexing of up to 8 different input signals, providing versatility in system integration.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, making it compatible with a wide range of other electronic components.

Propagation Delay (tpd): 244 ns

Offers fast signal processing speed, ensuring minimal delay in transmitting signals through the multiplexer/demultiplexer.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for use in industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature environments, ensuring reliable performance in various conditions.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MM74HC151J/A+ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

LG_MAX;IT ALSO HAS PROPAGATION DELAY OF 231NS

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

244 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MM74HC151J/A+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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