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MM74HC153N

Texas Instruments

MM74HC153N by Texas Instruments

The Texas Instruments MM74HC153N is a CMOS multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 2-6V, with a propagation delay of 35ns at nominal supply. Ideal for industrial applications requiring true output polarity and low power consumption.

Median Price

$2.052

Lifecycle Status

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22

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Freelance Electronics

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Holdelec - ElecDif-Pro

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Component Electronics Inc.

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PC Components Company LLC

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AZTECH Wire

Italy . 290 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 2,119 parts In-Stock

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

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One Stop Electronics

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Overview

Enhance your electronic projects with the MM74HC153N by Texas Instruments, a top-quality multiplexer & demultiplexer designed to deliver exceptional performance. With a reliable manufacturer like Texas Instruments behind it, this versatile component offers customers unmatched value and benefits. Perfect for a wide range of applications, this product boasts quick propagation delay, dual functions, and a low load capacitance. Upgrade your projects today with the MM74HC153N and experience superior efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer & demultiplexer, making it long-lasting and reliable.

Propagation Delay At Nominal Supply: 35 ns

Ensures fast signal processing and low latency, making it suitable for applications requiring quick data transmission.

No. of Functions: 2

Offers versatility by providing two functions in a single device, saving space and cost compared to separate units.

No. of Inputs: 4

Allows for multiple input signals to be processed simultaneously, increasing the flexibility and functionality of the device.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and standard supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Provides the ability to drive a moderate amount of load capacitance, ensuring stability and reliable performance.

Power Supplies (V): 2/6

Allows for flexibility in power options, catering to different system requirements and voltage levels.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures, suitable for industrial environments and applications that require robust performance.

Minimum Operating Temperature: -40 °C

Can operate in harsh environmental conditions with low temperatures, ensuring reliability in diverse operating environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MM74HC153N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MM74HC153N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-426-1595, 5962014261595, 5962-99-075-1353, 5962990751353

NIIN

014261595, 990751353

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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