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MM74HC251SJ

Onsemi

MM74HC251SJ by Onsemi

MM74HC251SJ by Onsemi is an 8-input multiplexer with a propagation delay of 256ns. It operates in temperatures ranging from -40 to 85 °C, making it suitable for industrial applications. With a small outline package style and dual terminal position, it offers versatile integration options.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,400 parts In-Stock

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3,400

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Vyrian

USA . 1,162 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$29.750

100+ parts

$27.073

1k+ parts

$24.395

10k+ parts

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870

$29.750

$27.073

$24.395

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Component Stockers USA

USA . 723 parts In-Stock

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$99.990

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723

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Problanco Electronics

Mexico . 7,053 parts In-Stock

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7,053

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TANS Electronics

Latvia . 6,330 parts In-Stock

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SupplyDigital Components

Austria . 5,733 parts In-Stock

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5,733

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Kulean Microsystems

USA . 5,626 parts In-Stock

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Supply Digital

USA . 1,942 parts In-Stock

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Corphita

USA . 1,748 parts In-Stock

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UHIMA Technologies

Türkiye . 649 parts In-Stock

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649

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Microchip USA

USA . 404 parts In-Stock

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404

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Corohmni

South Africa . 361 parts In-Stock

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Overview

Unlock the power of efficient data processing with the MM74HC251SJ by Onsemi. This multiplexer/demultiplexer offers unparalleled quality and reliability, backed by Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this versatile component streamlines complex circuits and enhances overall system performance. Experience the value and benefits of seamless signal routing, improved efficiency, and enhanced functionality with the MM74HC251SJ - your key to unlocking limitless possibilities in electronic design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and improving overall PCB design.

No. of Inputs: 8

Having 8 inputs provides versatility and flexibility in connecting multiple input signals, making it ideal for complex systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, making it suitable for compact electronic devices.

Propogation Delay (tpd): 256 ns

With a low propagation delay of 256 ns, this multiplexer & demultiplexer ensures fast switching of signals, minimizing latency in the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in elevated temperature environments.

Output Characteristics: 3-STATE

The 3-state output feature allows the output terminal to assume one of the three states: high impedance, logic 0, or logic 1, providing flexibility in signal routing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in cold temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and conductivity, ensuring reliable connections in the circuit.

Width: 5.3 mm

The compact width of 5.3 mm saves space on the PCB, allowing for denser and more efficient circuit designs.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures that the output signal is the complement of the input signal, providing a full range of signal options.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexer & Demultiplexer MM74HC251SJ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

256 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

MM74HC251SJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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