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MM74HC251SJX

Onsemi

MM74HC251SJX by Onsemi

MM74HC251SJX by Onsemi is an 8-input multiplexer with a propagation delay of 256 ns. It operates in industrial temperature range (-40 to 85 °C) and supports a supply voltage range of 2-6V. This CMOS technology device is ideal for applications requiring high-speed signal switching in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,965 parts In-Stock

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Digiode

USA . 839 parts In-Stock

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Problanco Electronics

Mexico . 8,315 parts In-Stock

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Kulean Microsystems

USA . 2,861 parts In-Stock

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SupplyDigital Components

Austria . 1,918 parts In-Stock

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TANS Electronics

Latvia . 1,228 parts In-Stock

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Corphita

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Supply Digital

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Corohmni

South Africa . 443 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MM74HC251SJX by Onsemi, a leading manufacturer in the industry. This versatile multiplexer/demultiplexer offers a wide range of applications, from data communication to industrial automation. With its high-quality construction and advanced technology, this product ensures seamless operation and optimal efficiency. Trust Onsemi to deliver superior products that meet your needs and exceed your expectations. Elevate your projects with the MM74HC251SJX and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer offers the flexibility to handle multiple input signals efficiently.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into existing circuit designs.

No. of Terminals: 16

16 terminals allow for versatile connectivity options and support for a wide range of external devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is suitable for compact electronic devices.

Propagation Delay (tpd): 256 ns

The low propagation delay of 256 ns ensures fast signal transmission, improving overall system performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for industrial applications that require extended temperature ranges.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the product to provide high impedance output when not enabled, reducing interference in multi-device setups.

Minimum Operating Temperature: -40 °C

The product can operate in harsh environments with a minimum operating temperature of -40 °C, ensuring reliable performance in various conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and facilitates efficient PCB layout design.

Maximum Seated Height: 2.1 mm

The low maximum seated height of 2.1 mm helps in maintaining a slim profile for space-constrained applications.

Width: 5.3 mm

The compact width of 5.3 mm allows for dense packing of components on the circuit board, optimizing use of space.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies circuit design and ensures compatibility with various signal processing techniques.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage of 2 V, the product is energy efficient and suitable for battery-operated devices.

Length: 10.1 mm

The length of 10.1 mm provides a compact footprint, making it suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments with varying temperature conditions.

Technology: CMOS

The use of CMOS technology delivers low power consumption and high noise immunity, making the product energy efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and improves reliability, making the product suitable for automated assembly processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure connection to the circuit board, ensuring reliable electrical contact.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6 V, the product can handle a wide range of input voltage levels, providing flexibility in system design.

Technical Specifications

Multiplexer & Demultiplexer MM74HC251SJX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

256 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

MM74HC251SJX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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