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JM38510/50601B2A

Texas Instruments

JM38510/50601B2A by Texas Instruments

JM38510/50601B2A by Texas Instruments is a TTL technology PLD with 20ns propagation delay. It's a ceramic, metal-sealed co-fired chip carrier with 20 terminals for military applications. Operating temperature ranges from -55°C to 125°C, making it suitable for harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,438 parts In-Stock

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Vyrian

USA . 2,991 parts In-Stock

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2,991

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$15.391

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271

$15.391

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One Stop Electronics

USA . 134 parts In-Stock

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$30.000

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134

$30.000

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Parana Technologies

USA . 1,522 parts In-Stock

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$149.729

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$13,904.623

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$134.756

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1,522

$149.729

$13,904.623

$134.756

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DigiPath Technology Company

USA . 1,479 parts In-Stock

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$164.870

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$151.681

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1,479

$164.870

$151.681

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ChromeModa Solutions

Germany . 6,134 parts In-Stock

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$168.235

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$137.953

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6,134

$168.235

$137.953

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IDEA Electronic Components Group

UK . 137 parts In-Stock

1+ parts

$168.235

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$159.823

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$151.412

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137

$168.235

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$151.412

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Corphita

USA . 3,462 parts In-Stock

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Overview

The JM38510/50601B2A by Texas Instruments is a high-quality Programmable Logic Device designed to deliver superior performance in various applications. With a reputation for excellence, Texas Instruments ensures that this PLD offers unmatched reliability and precision. Ideal for military-grade projects, this TTL technology-based device boasts a fast propagation delay of 20 ns, making it perfect for time-sensitive operations. Whether you're working on combinatorial functions or require a chip carrier package style, the JM38510/50601B2A provides exceptional value and benefits, setting a new standard in programmable ICs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and reliability, making this PLD suitable for harsh operating environments.

Propagation Delay: 20 ns

The fast propagation delay of 20 ns ensures quick response times in processing signals, making this PLD ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this PLD into circuit boards easier and more efficient.

Technology Used: TTL

The use of TTL technology ensures compatibility with other TTL components, simplifying circuit design and integration.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making this PLD suitable for compact electronic designs.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V makes this PLD compatible with standard power sources, offering ease of integration.

No. of Terminals: 20

With 20 terminals, this PLD provides flexibility in connectivity options, allowing for versatile circuit configurations.

Programmable IC Type: OT PLD

Being an OT PLD (Ordered-Termination Programmable Logic Device) allows for customized programming, enabling tailored functionality to suit specific application requirements.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers convenient handling and installation, enabling easy placement onto circuit boards.

Output Function: COMBINATORIAL

The combinatorial output function allows for complex logic operations to be performed, providing advanced functionality for diverse applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this PLD can withstand high temperature environments, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes this PLD suitable for use in a wide range of temperature conditions.

Position Of Terminal: QUAD

The quad position of terminals offers ease of connectivity and organization, simplifying the integration of this PLD into circuit designs.

Grading Of Temperature: MILITARY

Having a military-grade temperature rating ensures the reliability and durability of this PLD, making it suitable for mission-critical and rugged applications.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50601B2A attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Output Function:

Combinatorial

Propagation Delay:

20 ns

Technology:

TTL

Power Characteristics

Nominal Supply Voltage:

5

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Standards

JESD-30 Code:

S-CQCC-N20

Qualified:

No

Trade Compliance

JM38510/50601B2A Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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