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JM38510/50608BRA

Texas Instruments

JM38510/50608BRA by Texas Instruments

JM38510/50608BRA by Texas Instruments is a MIL-M-38510 Class B PLD with 30ns propagation delay, 5.5V max supply voltage, and TTL technology. Ideal for military applications requiring PAL-type architecture, it offers 12 inputs, 8 dedicated inputs, and 4 I/O lines in a ceramic package with through-hole terminals.

Median Price

$62.241

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1 parts In-Stock

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$12.941

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$12.941

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Component Electronics Inc.

Canada . 3 parts In-Stock

1+ parts

$111.540

100+ parts

$83.650

1k+ parts

$72.500

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3

$111.540

$83.650

$72.500

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Vyrian

USA . 6,844 parts In-Stock

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Digiode

USA . 1,413 parts In-Stock

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Resion

USA . 128 parts In-Stock

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128

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Electronic Expediters

USA . 26 parts In-Stock

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Electronics Depot

USA . 19 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 753 parts In-Stock

1+ parts

$8.273

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753

$8.273

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One Stop Electronics

USA . 281 parts In-Stock

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$30.000

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Parana Technologies

USA . 1,931 parts In-Stock

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$33.678

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$131.728

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$33.678

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DigiPath Technology Company

USA . 1,033 parts In-Stock

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$37.083

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$34.117

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$37.083

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ChromeModa Solutions

Germany . 3,537 parts In-Stock

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$37.840

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$31.029

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$37.840

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IDEA Electronic Components Group

UK . 1,950 parts In-Stock

1+ parts

$37.840

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$35.948

1k+ parts

$34.056

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$37.840

$35.948

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,395 parts In-Stock

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Microchip USA

USA . 2,330 parts In-Stock

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Overview

Looking to enhance your electronic projects with top-quality programmable logic devices? Look no further than the JM38510/50608BRA by Texas Instruments! With a MIL-M-38510 Class B screening level and TTL technology, this PLD offers fast propagation delay and versatile mixed output functions. Whether you're designing military-grade equipment or high-performance consumer electronics, this PAL-type device provides reliable functionality and precision. Trust Texas Instruments for superior quality and performance in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material provides durability and protection, making this product suitable for harsh environmental conditions.

Propagation Delay: 30 ns

Fast propagation delay ensures quick response time and efficient operation of the device.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for versatility in powering the device and compatibility with a wider range of systems.

Screening Level: MIL-M-38510 Class B

Military-grade screening level ensures high reliability and performance in critical applications.

Technology Used: TTL

TTL technology offers high-speed operation and low power consumption, making this product efficient and reliable.

No. of Inputs: 12

Having a larger number of inputs allows for more complex logic operations and flexibility in designing circuits.

Package Shape: RECTANGULAR

Rectangular package shape provides ease of handling and installation in various systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals ensure secure connections and easy soldering for integration into circuit boards.

Architecture: PAL-TYPE

PAL-type architecture offers programmable features that enable customization for specific application requirements.

Nominal Supply Voltage (V): 5

Stable nominal supply voltage ensures consistent and reliable performance of the PLD.

Packing Method: TUBE

Tube packing method provides protection during transportation and storage of the PLD.

No. of Terminals: 20

Having more terminals allows for more connections and flexibility in circuit design.

Programmable IC Type: OT PLD

Being a programmable IC type allows for reprogramming of the device for different logic functions as needed.

Package Style (Meter): IN-LINE

In-line package style facilitates space-saving and efficient use of PCB real estate.

Output Function: MIXED

The mixed output function allows for versatile output configurations for diverse application requirements.

No. of Product Terms: 64

Having a higher number of product terms enables more complex logic operations and customization.

Minimum Supply Voltage: 4.5 V

Having a low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows for operation in environments with elevated temperatures.

Pitch Of Terminal: 2.54 mm

Standard terminal pitch provides compatibility with existing PCB layouts and components.

Organization: 8 DEDICATED INPUTS, 4 I/O

Organized input and output configuration offers flexibility in circuit design and logic implementation.

No. of Dedicated Inputs: 8

Having dedicated inputs allows for specific signal handling and logic operations.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Finishing Of Terminal Used: Tin/Lead (Sn/Pb)

Tin/lead terminal finishing provides good solderability and reliable electrical connections.

Position Of Terminal: DUAL

Dual terminal position offers redundancy and secure connections for robust circuit performance.

Maximum Seated Height: 5.08 mm

Low maximum seated height allows for compact integration into systems with space constraints.

Width: 7.62 mm

Narrow width makes this PLD suitable for applications with limited space availability.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast operation and efficient processing of logic functions.

No. of Outputs: 8

Having multiple outputs allows for versatile signal routing and handling in circuit designs.

Length: 24.2 mm

Compact length design offers efficient use of space and easy integration into systems.

No. of I/O Lines: 4

Limited number of I/O lines simplifies circuit design and reduces complexity for specific applications.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures operational reliability in harsh environmental conditions.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50608BRA attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

8 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

12

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

4

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Width:

7.62 mm

Length:

24.2 mm

Maximum Seated Height:

5.08 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-M-38510 Class B

Trade Compliance

JM38510/50608BRA Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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