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JM38510/50501BLA

Texas Instruments

JM38510/50501BLA by Texas Instruments

JM38510/50501BLA by Texas Instruments is a 24-terminal PLD with TTL technology. It offers 25 ns propagation delay, 5.25 V max supply voltage, and operates at up to 40 MHz clock frequency. Ideal for military applications requiring MIL-M-38510 Class B screening level and combinatorial output function in a ceramic package.

Median Price

$165.100

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1 parts In-Stock

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$149.380

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Rochester

USA . 2 parts In-Stock

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$165.100

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$155.190

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$145.290

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Verical

USA . 2 parts In-Stock

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$193.988

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$181.613

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Digiode

USA . 4,342 parts In-Stock

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Vyrian

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Bristol Electronics

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PC Components Company LLC

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Resion

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R&J Components

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MISTER SPROCKETS

USA . 7 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 6 parts In-Stock

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A2Z Electronics, Inc.

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Eagle Technology Solutions

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EPE Components Inc.

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Odi Ramu Company

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Electronic Expediters

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Inland Empire Components Inc.

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AZTECH Wire

Italy . 736 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$112.041

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ChromeModa Solutions

Germany . 1,891 parts In-Stock

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$124.269

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$101.901

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IDEA Electronic Components Group

UK . 61 parts In-Stock

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$124.269

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$118.056

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$111.842

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Corphita

USA . 4,978 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Overview

Experience unmatched performance and reliability with the JM38510/50501BLA by Texas Instruments, a top-notch Programmable Logic Device designed to meet the most demanding applications. Crafted with precision using advanced technology, this PLD offers lightning-fast propagation delay of 25 ns and a maximum clock frequency of 40 MHz. Perfect for military-grade projects, this device boasts MIL-M-38510 Class B screening level and operates flawlessly in extreme temperatures ranging from -55°C to 125°C. Trust Texas Instruments for superior quality and elevate your designs with the JM38510/50501BLA today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, making the product reliable in harsh environments.

Propagation Delay: 25 ns

Fast propagation delay allows for quick processing of signals, making the product suitable for time-sensitive applications.

Maximum Supply Voltage: 5.25 V

Can handle higher supply voltages, providing flexibility in power requirements.

Screening Level: MIL-M-38510 Class B

Meets military screening standards for quality and reliability, ensuring consistent performance in demanding conditions.

Technology Used: TTL

TTL technology offers high-speed operation and low power consumption, making the product efficient and suitable for various applications.

Nominal Supply Voltage (V): 5

Standard supply voltage makes integration into existing systems easier.

Output Function: COMBINATORIAL

Combinatorial output function allows for complex logic operations, enhancing the product's versatility.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and extreme temperature environments.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast data processing and execution of commands, enhancing overall performance.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliability and performance in harsh conditions, making it suitable for defense or aerospace applications.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50501BLA attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 6 I/O

Output Function:

Combinatorial

No. of Dedicated Inputs:

14

No. of I/O Lines:

6

Maximum Clock Frequency:

40 MHz

Propagation Delay:

25 ns

Technology:

TTL

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Width:

7.62 mm

Length:

32.005 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Qualified:

No

Screening Level:

MIL-M-38510 Class B

Trade Compliance

JM38510/50501BLA Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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