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JM38510/50601BSA

Texas Instruments

JM38510/50601BSA by Texas Instruments

JM38510/50601BSA by Texas Instruments is a TTL technology PLD with 20ns propagation delay. It has 20 terminals, operates b/w -55°C to 125°C, and is MILITARY graded. This rectangular flatpack PLD is used for combinatorial output functions in applications requiring high reliability under extreme temperatures.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 3,861 parts In-Stock

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Vyrian

USA . 3,440 parts In-Stock

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3,440

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Distributors (Availability)

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AZTECH Wire

Italy . 239 parts In-Stock

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$16.162

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One Stop Electronics

USA . 352 parts In-Stock

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$24.000

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Parana Technologies

USA . 491 parts In-Stock

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$162.769

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DigiPath Technology Company

USA . 1,426 parts In-Stock

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$179.228

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$164.890

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1,426

$179.228

$164.890

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ChromeModa Solutions

Germany . 3,961 parts In-Stock

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$182.886

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$149.967

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3,961

$182.886

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IDEA Electronic Components Group

UK . 108 parts In-Stock

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$182.886

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$173.742

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$164.597

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108

$182.886

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$164.597

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Corphita

USA . 2,020 parts In-Stock

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Overview

Upgrade your electronic designs with the Texas Instruments JM38510/50601BSA Programmable Logic Device. Crafted with precision and expertise by Texas Instruments, this PLD offers unparalleled quality and reliability for a wide range of applications. Whether you're looking to optimize circuit performance or enhance system functionality, this TTL technology-based device delivers fast propagation delay and combinatorial output functions with ease. Trust in Texas Instruments to provide you with the value, benefits, and advantages you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, ensuring reliable performance even in harsh environments.

Propagation Delay: 20 ns

The low propagation delay allows for fast processing and response times, making this PLD ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and integration easier, saving space and reducing assembly time.

Technology Used: TTL

TTL technology offers low power consumption and compatibility with a wide range of systems, enhancing versatility and efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy placement on circuit boards, optimizing design layout.

Form Of Terminal: FLAT

Flat terminals simplify soldering and connection processes, ensuring reliable electrical contact for consistent performance.

Nominal Supply Voltage (V): 5

Operating at a common voltage supply simplifies power management and compatibility with standard systems.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and compatibility with various circuit configurations.

Programmable IC Type: OT PLD

The programmable nature of this PLD offers flexibility for customization and adaptation to specific application requirements.

Package Style (Meter): FLATPACK

The flatpack package style provides a compact form factor for space-constrained designs, enabling efficient integration in compact systems.

Output Function: COMBINATORIAL

Combinatorial output function allows for complex logic operations and versatile functionality, making this PLD suitable for diverse applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this PLD can withstand elevated temperatures, ensuring consistent performance in demanding environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range enables reliable operation even in cold environments, increasing the PLD's versatility.

Position Of Terminal: DUAL

Dual terminal positioning offers flexibility in connection options and simplifies installation, enhancing usability and convenience.

Grading Of Temperature: MILITARY

Military-grade temperature grading indicates high reliability and ruggedness, making this PLD suitable for critical applications in challenging environments.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50601BSA attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Output Function:

Combinatorial

Propagation Delay:

20 ns

Technology:

TTL

Power Characteristics

Nominal Supply Voltage:

5

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Standards

JESD-30 Code:

R-GDFP-F20

Qualified:

No

Trade Compliance

JM38510/50601BSA Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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