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JM38510/50602BRA

Texas Instruments

JM38510/50602BRA by Texas Instruments

JM38510/50602BRA by Texas Instruments is a TTL technology PLD with 15ns propagation delay and 5.5V max supply voltage. Ideal for military applications, it features 8 dedicated inputs, operates b/w -55°C to 125°C, and supports a clock frequency of up to 41.6MHz.

Median Price

$37.107

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 13 parts In-Stock

1+ parts

$37.107

100+ parts

$38.963

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$36.736

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13

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$36.736

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Vyrian

USA . 6,043 parts In-Stock

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Digiode

USA . 1,441 parts In-Stock

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1,441

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Mil-Aero Solutions, Inc.

USA . 822 parts In-Stock

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Electronics Depot

USA . 97 parts In-Stock

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Electronic Expediters

USA . 36 parts In-Stock

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36

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Distributors (Availability)

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One Stop Electronics

USA . 853 parts In-Stock

1+ parts

$18.000

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853

$18.000

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AZTECH Wire

Italy . 323 parts In-Stock

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$18.640

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323

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Parana Technologies

USA . 1,806 parts In-Stock

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$112.043

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DigiPath Technology Company

USA . 2,041 parts In-Stock

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$123.373

100+ parts

$113.503

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2,041

$123.373

$113.503

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ChromeModa Solutions

Germany . 3,154 parts In-Stock

1+ parts

$125.891

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$103.231

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

1+ parts

$125.891

100+ parts

$119.596

1k+ parts

$113.302

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1,604

$125.891

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$113.302

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 2,180 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the JM38510/50602BRA by Texas Instruments. Crafted with precision and reliability in mind, this Programmable Logic Device is designed to exceed expectations. Perfect for a wide range of applications, this PLD offers unparalleled performance and efficiency. Experience seamless functionality and innovative features that will elevate your projects to new heights. Trust Texas Instruments to deliver quality products that provide value and benefits beyond compare. Elevate your designs with the JM38510/50602BRA and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material provides durability and reliable performance in various environmental conditions, making this product suitable for industrial applications.

Propagation Delay: 15 ns

With a low propagation delay of 15 ns, this PLD offers fast processing speeds and efficient operation, making it ideal for time-sensitive applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in power supply options, making this PLD versatile and compatible with different voltage systems.

Screening Level: MIL-M-38510 Class B

The MIL-M-38510 Class B screening level ensures high reliability and quality standards, making this PLD suitable for critical military or aerospace applications.

Technology Used: TTL

Utilizing TTL technology provides compatibility with other TTL components, simplifying system integration and ensuring consistent signal levels for reliable performance.

Form Of Terminal: THROUGH-HOLE

The through-hole terminal design offers secure connections and ease of soldering, enhancing the reliability and durability of the PLD in various electronic systems.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50602BRA attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 0 I/O

Output Function:

Registered

No. of Dedicated Inputs:

8

No. of I/O Lines:

0

Maximum Clock Frequency:

41.6 MHz

Propagation Delay:

15 ns

Technology:

TTL

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Width:

7.62 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Screening Level:

MIL-M-38510 Class B

Trade Compliance

JM38510/50602BRA Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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