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JM38510/50404BRA

Texas Instruments

JM38510/50404BRA by Texas Instruments

JM38510/50404BRA by Texas Instruments is a TTL technology OT PLD with 30ns propagation delay, 20MHz clock frequency, and MILITARY grading. It is used in applications requiring mixed output functions, operating b/w -55 to 125 °C, with 5V nominal voltage.

Median Price

$17.394

Lifecycle Status

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Freelance Electronics

USA . 477 parts In-Stock

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$17.394

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$18.264

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American Microsemiconductor Inc.

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Mil-Aero Solutions, Inc.

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Bristol Electronics

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PC Components Company LLC

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Microfarads

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Eagle Technology Solutions

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First Choice Components Inc.

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Sensible Micro Corp

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AZTECH Wire

Italy . 358 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 4,936 parts In-Stock

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IDEA Electronic Components Group

UK . 450 parts In-Stock

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Corphita

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Overview

Elevate your circuit design with the high-quality JM38510/50404BRA by Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-notch Programmable Logic Devices (PLD) like no other. This versatile component offers a wide range of applications and benefits, from improved performance to enhanced functionality. Designed with precision and reliability in mind, this PLD is perfect for military-grade projects that require optimal performance under extreme conditions. Upgrade your system today with the unmatched value and advantages of the JM38510/50404BRA by Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection, ensuring the PLD can withstand harsh environmental conditions.

Propagation Delay: 30 ns

The low propagation delay of 30 ns allows for fast signal processing and high-speed operations in the programmable logic device.

Screening Level: MIL-M-38510 Class B

The MIL-M-38510 Class B screening level ensures high reliability and quality standards, making this PLD suitable for critical applications.

Technology Used: TTL

The use of TTL technology ensures compatibility with a wide range of systems and devices, making this PLD versatile and interoperable.

Nominal Supply Voltage (V): 5

The 5V nominal supply voltage provides the necessary power for the PLD to function efficiently and reliably.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this PLD can operate in high-temperature environments without compromising performance.

Maximum Clock Frequency: 20 MHz

The maximum clock frequency of 20 MHz allows for high-speed operation and efficient processing of signals in the programmable logic device.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures that this PLD can meet stringent requirements for reliability and performance in challenging environments.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50404BRA attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Output Function:

Mixed

Maximum Clock Frequency:

20 MHz

Propagation Delay:

30 ns

Technology:

TTL

Power Characteristics

Nominal Supply Voltage:

5

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Qualified:

No

Screening Level:

MIL-M-38510 Class B

Trade Compliance

JM38510/50404BRA Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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