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JM38510/50603BRA

Texas Instruments

JM38510/50603BRA by Texas Instruments

JM38510/50603BRA by Texas Instruments is a TTL technology PLD with 20ns propagation delay and 5.5V max supply voltage. Ideal for MILITARY applications, it features 8 dedicated inputs, 2 I/O lines, and operates b/w -55 to 125 °C.

Median Price

$28.940

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 210 parts In-Stock

1+ parts

-

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$28.940

1k+ parts

$25.890

10k+ parts

$24.370

210

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$28.940

$25.890

$24.370

DigiKey

USA . 210 parts In-Stock

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210

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Freelance Electronics

USA . 53 parts In-Stock

1+ parts

$17.394

100+ parts

$18.264

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$17.220

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53

$17.394

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$17.220

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Digiode

USA . 3,678 parts In-Stock

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$30.552

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$30.552

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DigiKey Marketplace

USA . 210 parts In-Stock

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$33.450

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$33.450

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Vyrian

USA . 8,375 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 185 parts In-Stock

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Electronic Expediters

USA . 56 parts In-Stock

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Resion

USA . 23 parts In-Stock

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,036 parts In-Stock

1+ parts

$28.944

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$28.944

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Parana Technologies

USA . 1,310 parts In-Stock

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$58.989

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1,310

$58.989

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DigiPath Technology Company

USA . 496 parts In-Stock

1+ parts

$64.954

100+ parts

$59.758

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496

$64.954

$59.758

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ChromeModa Solutions

Germany . 3,510 parts In-Stock

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$66.280

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$54.350

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3,510

$66.280

$54.350

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IDEA Electronic Components Group

UK . 1,785 parts In-Stock

1+ parts

$66.280

100+ parts

$62.966

1k+ parts

$59.652

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1,785

$66.280

$62.966

$59.652

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Kepictronics

USA . 210 parts In-Stock

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Overview

Unlock the power of Texas Instruments with the JM38510/50603BRA Programmable Logic Device. Designed with precision and reliability in mind, this PLD offers unparalleled performance for a wide range of applications. From military to industrial use, this versatile device delivers a seamless experience with a maximum clock frequency of 41.6 MHz and a robust supply voltage range. Trust in Texas Instruments to provide top-notch quality and innovation, making the JM38510/50603BRA the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the PLD, ensuring long-term reliability.

Propagation Delay: 20 ns

Fast propagation delay allows for quick response times and efficient operation.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, making it versatile for various applications.

Technology Used: TTL

TTL technology is known for its reliability and compatibility with a wide range of systems.

No. of Terminals: 20

Provides ample connectivity options for interfacing with other components.

Output Function: MIXED

Allows for different types of outputs to accommodate diverse requirements.

Maximum Clock Frequency: 41.6 MHz

High clock frequency enables fast processing and data throughput.

Grading Of Temperature: MILITARY

Designed to operate in harsh environments, meeting stringent military standards.

Technical Specifications

Programmable Logic Devices (PLD) JM38510/50603BRA attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 2 I/O

Output Function:

Mixed

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

41.6 MHz

Propagation Delay:

20 ns

Technology:

TTL

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Width:

7.62 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Screening Level:

MIL-M-38510 Class B

Trade Compliance

JM38510/50603BRA Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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