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ISO7821FDW

Texas Instruments

ISO7821FDW by Texas Instruments

ISO7821FDW by Texas Instruments is a dual-function interface IC with 2 channels, operating at -55 to 125°C. It features a small outline package style, Gull Wing terminal form, and CMOS technology. Ideal for military-grade applications requiring a supply voltage of 2.25-5.5V in surface-mount designs.

Median Price

$5.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,330 parts In-Stock

1+ parts

$5.670

100+ parts

$4.968

1k+ parts

$2.807

10k+ parts

-

29,330

$5.670

$4.968

$2.807

-

Mouser Electronics

USA . 182 parts In-Stock

1+ parts

$8.810

100+ parts

$6.300

1k+ parts

$4.200

10k+ parts

-

182

$8.810

$6.300

$4.200

-

Rochester

USA . 19 parts In-Stock

1+ parts

-

100+ parts

$3.800

1k+ parts

$3.400

10k+ parts

$3.200

19

-

$3.800

$3.400

$3.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,029 parts In-Stock

1+ parts

$3.705

100+ parts

-

1k+ parts

-

10k+ parts

-

3,029

$3.705

-

-

-

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$4.610

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$4.610

-

-

-

Vyrian

USA . 3,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,056

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,825 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

-

9,825

$3.310

-

-

-

Corphita

USA . 1,791 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,791

$3.510

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.610

100+ parts

$4.518

1k+ parts

$4.380

10k+ parts

$4.287

100

$4.610

$4.518

$4.380

$4.287

Parana Technologies

USA . 1,769 parts In-Stock

1+ parts

$11.726

100+ parts

-

1k+ parts

$12.122

10k+ parts

-

1,769

$11.726

-

$12.122

-

DigiPath Technology Company

USA . 1,798 parts In-Stock

1+ parts

$12.912

100+ parts

$11.879

1k+ parts

-

10k+ parts

-

1,798

$12.912

$11.879

-

-

ChromeModa Solutions

Germany . 4,511 parts In-Stock

1+ parts

$13.175

100+ parts

$10.804

1k+ parts

-

10k+ parts

-

4,511

$13.175

$10.804

-

-

IDEA Electronic Components Group

UK . 829 parts In-Stock

1+ parts

$13.175

100+ parts

$12.516

1k+ parts

$11.858

10k+ parts

-

829

$13.175

$12.516

$11.858

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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Overview

Discover the cutting-edge technology of the Texas Instruments ISO7821FDW, a high-quality interface circuit designed for a wide range of applications. With a durable plastic body and dual terminal position, this small outline package offers reliability and performance. Whether you're in the military or industrial sector, this versatile IC provides seamless function integration with its 2 channels and CMOS technology. Trust Texas Instruments to deliver top-notch products like the ISO7821FDW that exceed expectations and provide value to customers looking for innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the IC onto a circuit board.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can handle a wide range of input voltages, offering versatility in application.

No. of Functions: 2

Having multiple functions in a single IC helps in reducing component count and simplifying circuit design, saving space and cost.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle during assembly, providing convenience in manufacturing processes.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and interfaces, enabling the IC to communicate with various external components.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage requirement, this IC can operate efficiently even in low power situations, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliability and stability of the IC under various environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range allows the IC to perform effectively in extreme cold environments, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, promoting long-term usability.

Width: 7.5 mm

The compact width of the IC enables it to be used in space-constrained applications, increasing compatibility and flexibility.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering of the IC onto PCBs, ensuring strong and durable connections.

Temperature Grade: MILITARY

Being military-grade indicates that this IC meets stringent quality and reliability standards, making it suitable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in various electronic devices.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V is commonly used in many electronic systems, providing compatibility and ease of integration.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that this IC has a moderate level of moisture sensitivity, requiring proper handling and storage to prevent damage.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components or systems, enhancing connectivity and functionality.

Technical Specifications

Other Function Interface ICs ISO7821FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7821FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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